EOL Die Sustainment Program (EDSP)

EDSP will support our customers in challenging situations where a product has or will become end-of-life. To avoid costly re-qualification, mitigate counterfeit risk, Micross offers this program solution to sustain the performance of critical platforms and eliminate the need for costly re-designs.

As the largest global supplier of bare die, Micross offers flexibility to adapt our suppliers’ standard products to the unique requirements of a customer’s system or platform. Over the years, Micross has developed key relationships with leading semiconductor manufacturers providing us with access to thousands of different part types in support of customer’s need to extend the life of components 5-10+ years after EOL.

Micross EDSP - Introduction, Growth, Maturity, Decline

How can EDSP help you?

Micross EDSP provides exact drop in replacement die or fully packaged solutions utilizing the original qualified die, thereby eliminating the need for costly requalification or design changes.

  • OEMs... Micross can support your product needs past natural component life cycles.
  • ODMs... Micross enables you to refocus product line resources utilizing our world-class value-added die handling and packaging services.
Product Life Span

We would be happy to discuss your sustainment needs and how we can support your lifecycle requirements.

To begin solving your sustainment needs today, please submit your information and we will contact you soon.


Combining all of our capabilities to bring you a One Source Solution