Product Reconditioning

When Military or Space grade products are not available, Micross will recondition COTS product to OEM specifications.

Component Solutions

Re-tin ROHS compliant parts where leaded interconnects are required
  • Robotic Hot Solder Dip
  • BGA Reballing
Lead Attach
  • Lead Attach to ceramic or plastic Leadless Chip Carrier
  • Lead Replacement
  • CGA Attach
Reform leads to OEM specification
  • Trim & Form
  • Reconditioning of bent or damaged leads
  • Lead Attach to ceramic or plastic Leadless Chip Carrier
  • Tape and Reel
  • 3D Scan
  • Bake and Package
  • Marking & Labeling

RHSD, BGA, Lead Attach, & CGA

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PCB Solutions
  • Rework & Repair enabling Non-working qualified PCBs to be reused
  • Specializing in package-on-package, LGA, QFN, CSP and other challenging components
  • Adhere to IPC-7711/7721 rework standards
  • 4-point inspection on each component placed
  • 5D X-ray, used to locate & address the most difficult manufacturing and reworking issues
  • Trace modification in inaccessible areas, under BGAs or other sensitive components
  • Repair damaged traces and solder mask, incorrectly installed components, defects
  • Restore pad sites for any component, including fine-pitch and variable-pitch BGAs, QFNs, and package-on-package stacks
  • Removal and replacement of BGA, Micro BGA, and flip-chip, plus the majority of fine-pitch components

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