Die & Hi-Rel Components - Apopka, FL


  • 85,000 sq. ft. Overall Facility
  • 40+ Years of Viable Die Storage
  • 15 Million Die in Storage
  • 850 Wafers Probed per Year
  • 4,700 Wafer Through Saw per Year
  • Over 8 Million Die Sorted per Year
  • Over 37 Million Die Probed per Year
  • 250,000 Units Assembled & Packaged per Year
  • 0.5 Micron Accuracy Packaging Placement
  • 340,000 Units Unscreened Per Year
  • 29,000 sq. ft. of Clean Rooms with Class H & K Certification

Apopka, Florida


(407) 298 7100

Die & Wafer


World's largest franchised offering of bare die & wafer with access to thousand of different part types

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Quick Turn Services

Micross Quick Turn now gets inventory to customers faster and easier than before. Quote, Order, Ship!

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Wafer Processing

Comprehensive array of capabilities to fully process wafers; from wafer saw to wafer bumping for all materials

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Products & Services

Hi-Rel ICs & Components

QML supplier, certified, with over thirty-five years of supply hi-reliability components

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Multi-Chip Modules (MCMs)

Flip chip assembly, precision die placement, heterogeneous integration, PADS process

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Assembly Services

Comprehensive array of in-house assembly capabilities that spans both the United States and Europe

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Plastic Packaging

Chip scale packages offer near-die size footprints and reduce package thickness and weight

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Hermetic Packaging

Ceramic, metal can, two/four-sided LCC, gull wing, QFP, PGA, formed-leaded flat pack

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