Component Solutions

Utilize the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology  in your hi-rel application. Micross' Component Modification Services ruggedizes components to withstand the most extreme environments.

BGA Reballing

A process that flushes all lead-free balls and alloy residue from the pads and replaces them with Tin-Lead balls

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Robotic Hot Solder Dip (RHSD)

Eliminates the risk of tin whiskers without damaging the component

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Lead Attach

Proprietary process developed to maintain the integrity of component-to-PCB solder joints under stress

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CGA Attach

Guarantees a superior hi-reliability interconnect and best suited for assembly & component attached integrity

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Trim/Form & Reconditioning

Choose from various shipment options with the ability to customize to specifications

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