Micross Components Acquires SemiDice, Inc.
Micross Components, a leading global provider of high-reliability die & wafer products, and value added services, acquires Semi Dice, Inc. The combination creates the most comprehensive portfolio of end-to-end high-reliability die and wafer solutions and services for the aerospace, defense, medical, and industrial markets.
Micross Expands Capabilities
Acquires the Microelectronics Business Assets of Ultra CEMS
July 7th, 2021
4X the Memory… Same Footprint
The Most Compact & Lowest Power Hermetic Space-Grade 64Mb MRAM
June 3rd, 2021
Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross expands its exclusive partnership with Avalanche Technology.
Micross Strengthens its Component Modification Capabilities with the Consolidation of US Operations into two of its Flag Ship Next-Gen Facilities
Micross announces the combining and relocation of its component modification services (CMS) facility.
Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.
Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.
Micross announces that Vincent M. Buffa has been appointed CEO.
Over 70 years of experience serving Aerospace & Defence, Space, Medical, Industrial
& Commercial customers in the U.S. and Europe.
Corfin Industries is now Micross
This combination brings together the in-depth market expertise of the two companies to further strengthen Micross’ “One Source One Solution” service offering. The Company is committed to provide an unparalleled array of high-reliability electronic product, packaging, test and modification services servicing the US, European and Global markets.