Micross US and UK Holiday Closures. Read More

Micross Operations Notification - Hurricane Ian. Learn More

$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US

We’re pleased to announce Micross has been awarded up to $134.3 million by the Department of Defense (DoD) under the IBAS Cornerstone RESHAPE
program, with $45.6 million obligated at the time of the award to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity
for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions.

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November 27th, 2023


Webinar Recording: "Realize the Leading Advantages & Best Practices in Preparing Microelectronics for High-Reliability Applications"

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Recorded: November 30th, 2023

Webinar Recording: Ruggedizing COTS Components for Hi-Rel Applications

VIEW NOW

Recorded: September 28th, 2023


Press & Media

Announcements

Micross Components and EPC Sign Global Bare Die Distribution Agreement
Micross Components and EPC Sign Global Bare Die Distribution Agreement

Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.

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Appointment of Kenneth Kates as VP of Finance & Corporate Development
Appointment of Kenneth Kates as VP of Finance & Corporate Development

Micross announces that Kenneth Kates has been appointed VP of Finance & Corporate Development.

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Micross and SemiQ Sign Global Bare Die Distribution Agreement
Micross and SemiQ Sign Global Bare Die Distribution Agreement

Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.

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Michael Fuggini has been Appointed Sr. VP, Operations of Micross
Michael Fuggini has been Appointed Sr. VP, Operations of Micross

Micross announces that Michael Fuggini has been appointed Sr. VP.

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Vincent Buffa, Named CEO of Micross Components, Inc.
Vincent Buffa, Named CEO of Micross Components, Inc.

Micross announces that Vincent M. Buffa has been appointed CEO.

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For more than 40 years, Micross has been a trusted source for
the global aerospace, defense, space, medical, energy, communications, and industrial markets.

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4X the Memory… Same Footprint

The Most Compact & Lowest Power Hermetic Space-Grade 64Mb MRAM

Micross & Avalanche Technology expand exclusive partnership to provide SWaP optimized hi-rel non-volatile 64Mb MRAM for space & aerospace applications.

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PRESS RELEASE

Released June 3rd, 2021

New 64Mb MRAM

One Source

Sustainment Solutions

Micross can tailor any facet of the sustainment process to fit customer’s unique requirements or entire program management for broader lifecycle management solutions.

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Sustainment Brochure

Now an authorized worldwide supplier of
EPC's GaN products offered in Die Form.

EPC

Offers SiC power semiconductor devices
supported in die form thru Micross.

Now an authorized worldwide supplier of
SemiQ SiC products offered in Die Form.

SemiQ

Offers SiC power semiconductor devices
supported in die form thru Micross.

Corfin Industries is now Micross

This combination brings together the in-depth market expertise of the two companies to further strengthen Micross’ “One Source One Solution” service offering. The Company is committed to provide an unparalleled array of high-reliability electronic product, packaging, test and modification services servicing the US, European and Global markets.

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