Micross is now the Global Distributor for Apogee Semiconductor
LIVE WEBINAR: Optimizing Hi-Rel Electronics Design for Your Application
Designing hi-rel electronics and being able to maintain system production or material support beyond planned program life has become an increasingly challenging endeavor. Fortunately, there are many viable alternatives that will enable you to procure and secure the electronic components needed to optimize your design and maintain production. We have gathered veteran industry experts in the field of semiconductors and advanced microelectronics packaging and assembly, to share their insights on the logic and rationale designers should consider.
Please join us on Thursday, July 7th at 1PM EDT for this insightful webinar.
July 7th, 2022 at 1pm EDT
MICROSS & C-MAC Announce Partnership to Service the U.K. Aerospace & Defence Market
Close synergies greatly expand the hi-rel microelectronics product and service offering of both companies.
Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross expands its exclusive partnership with Avalanche Technology.
Micross & Avalanche Partner to Offer the Smallest and Lowest Power Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross announces an exclusive partnership with Avalanche Technology.
Micross Strengthens its Component Modification Capabilities with the Consolidation of US Operations into two of its Flag Ship Next-Gen Facilities
Micross announces the combining and relocation of its component modification services (CMS) facility.
Micross Components and EPC Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.
Appointment of Kenneth Kates as VP of Finance & Corporate Development
Micross announces that Kenneth Kates has been appointed VP of Finance & Corporate Development.
Micross and SemiQ Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.
Michael Fuggini has been Appointed Sr. VP, Operations of Micross
Micross announces that Michael Fuggini has been appointed Sr. VP.
Vincent Buffa, Named CEO of Micross Components, Inc.
Micross announces that Vincent M. Buffa has been appointed CEO.
Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross expands its exclusive partnership with Avalanche Technology.
Now an authorized worldwide supplier of
EPC's GaN products offered in Die Form.
Offers SiC power semiconductor devices
supported in die form thru Micross.
Now an authorized worldwide supplier of
SemiQ SiC products offered in Die Form.
Offers SiC power semiconductor devices
supported in die form thru Micross.
