"Realize the Leading Advantages & Best Practices
in Preparing Microelectronics for High-Reliability Applications"
$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
We’re pleased to announce Micross has been awarded up to $134.3 million by the Department of Defense (DoD) under the IBAS Cornerstone RESHAPE
program, with $45.6 million obligated at the time of the award to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity
for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions.
November 27th, 2023
Micross + ISOCOM Ltd.
Webinar Recording: "Realize the Leading Advantages & Best Practices in Preparing Microelectronics for High-Reliability Applications"
Recorded: November 30th, 2023
Micross + ISOCOM Ltd.
Webinar Recording: Ruggedizing COTS Components for Hi-Rel Applications
Recorded: September 28th, 2023
Acquisition Expands Micross' High-Rel Power Management Solution Capabilities
Micross Components’ Hi-Rel Products Division Expands Leadership with the Appointments of General Managers Michael Agic and Estro Vitantonio
Hi-Rel Products Division Expands Leadership
Micross Acquires PAAL Technologies and Expands its Hi-Rel Components Offering with MIL-STD-1553 Data Bus Couplers and RF/Wideband Transformers
Micross Acquires PAAL Technologies and Expands its Hi-Rel Components Offering
Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.
Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.
Micross announces that Vincent M. Buffa has been appointed CEO.
Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross expands its exclusive partnership with Avalanche Technology.
Corfin Industries is now Micross
This combination brings together the in-depth market expertise of the two companies to further strengthen Micross’ “One Source One Solution” service offering. The Company is committed to provide an unparalleled array of high-reliability electronic product, packaging, test and modification services servicing the US, European and Global markets.