Micross is now the Global Distributor for Apogee Semiconductor
Micross Announces Global Distribution Partnership with EPC Space...
Expands Rad-Hard Gallium Nitride (GaN) Power Device Offering
EPC Space technology produces GaN devices that are smaller, lighter and better performing, meaning the devices have many times superior switching performance compared to silicon solutions. To complement the EPC Space discrete products, Micross will also distribute EPC Space’s family of rad hard enhancement mode GaN drivers and power stages.
July 26th, 2022
MICROSS & C-MAC Announce Partnership to Service the U.K. Aerospace & Defence Market
Close synergies greatly expand the hi-rel microelectronics product and service offering of both companies.
Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross expands its exclusive partnership with Avalanche Technology.
Micross & Avalanche Partner to Offer the Smallest and Lowest Power Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross announces an exclusive partnership with Avalanche Technology.
Micross Strengthens its Component Modification Capabilities with the Consolidation of US Operations into two of its Flag Ship Next-Gen Facilities
Micross announces the combining and relocation of its component modification services (CMS) facility.
Micross Components and EPC Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.
Appointment of Kenneth Kates as VP of Finance & Corporate Development
Micross announces that Kenneth Kates has been appointed VP of Finance & Corporate Development.
Micross and SemiQ Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.
Michael Fuggini has been Appointed Sr. VP, Operations of Micross
Micross announces that Michael Fuggini has been appointed Sr. VP.
Vincent Buffa, Named CEO of Micross Components, Inc.
Micross announces that Vincent M. Buffa has been appointed CEO.
Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross expands its exclusive partnership with Avalanche Technology.
Now an authorized worldwide supplier of
EPC's GaN products offered in Die Form.
Offers SiC power semiconductor devices
supported in die form thru Micross.
Now an authorized worldwide supplier of
SemiQ SiC products offered in Die Form.
Offers SiC power semiconductor devices
supported in die form thru Micross.
