New Release: 1Gb MRAM!
Offering the Highest Density Hi-Rel Non-Volatile Memory in the
Most Compact & Lowest Power Package
More than 64X the density of our initial 16Mb MRAM,
with an improved bit density of 2.844Mb/mm2 vs 163.84Kb/mm2.
September 14th, 2021
"The Supply Chain Storm:
Navigating EOL & DMSMS"
Webinar held August 19th, 2021
DSEI 2021 - London, Sept. 14-17
Meet with our product experts and executives for your program needs
Close synergies greatly expand the hi-rel microelectronics product and service offering of both companies.
Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross expands its exclusive partnership with Avalanche Technology.
Micross & Avalanche Partner to Offer the Smallest and Lowest Power Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross announces an exclusive partnership with Avalanche Technology.
Micross Strengthens its Component Modification Capabilities with the Consolidation of US Operations into two of its Flag Ship Next-Gen Facilities
Micross announces the combining and relocation of its component modification services (CMS) facility.
Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.
Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.
Micross announces that Vincent M. Buffa has been appointed CEO.
Over 70 years of experience serving Aerospace & Defence, Space, Medical, Industrial
& Commercial customers in the U.S. and Europe.
Corfin Industries is now Micross
This combination brings together the in-depth market expertise of the two companies to further strengthen Micross’ “One Source One Solution” service offering. The Company is committed to provide an unparalleled array of high-reliability electronic product, packaging, test and modification services servicing the US, European and Global markets.