Webinar
Chiplets - Optimized Device Integration, SWaP Performance & Time-to-Market
In this webinar, we will explore how Chiplets efficiently address today's market needs, highlight the key points to be considered with a Chiplet solution, and provide insight into the current state of Chiplets, which have not settled on one industry-wide standard for interconnects, communication protocols, and packaging. Experts in BEOL processing, advanced 2.5/3D heterogenous integration, testing, and component packaging will present the latest developments, standards, protocols, and Chiplet design methodology. Attendees will gain deep insight into the considerations and best practices in leveraging the value and performance of Chiplets for high-reliability systems.
May 1, 2025
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Hi-Rel Microelectronics & Services
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