Live Webinar
"Realize the Leading Advantages & Best Practices
in Preparing Microelectronics for High-Reliability Applications"
$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
We’re pleased to announce Micross has been awarded up to $134.3 million by the Department of Defense (DoD) under the IBAS Cornerstone RESHAPE
program, with $45.6 million obligated at the time of the award to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity
for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions.
November 27th, 2023
Micross to Acquire High-Reliability DC-DC Converter Business of Infineon Technologies AG
Acquisition Expands Micross' High-Rel Power Management Solution Capabilities
Micross Components’ Hi-Rel Products Division Expands Leadership with the Appointments of General Managers Michael Agic and Estro Vitantonio
Hi-Rel Products Division Expands Leadership
Micross Acquires PAAL Technologies and Expands its Hi-Rel Components Offering with MIL-STD-1553 Data Bus Couplers and RF/Wideband Transformers
Micross Acquires PAAL Technologies and Expands its Hi-Rel Components Offering
Micross Components and EPC Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.
Appointment of Kenneth Kates as VP of Finance & Corporate Development
Micross announces that Kenneth Kates has been appointed VP of Finance & Corporate Development.
Micross and SemiQ Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.
Michael Fuggini has been Appointed Sr. VP, Operations of Micross
Micross announces that Michael Fuggini has been appointed Sr. VP.
Vincent Buffa, Named CEO of Micross Components, Inc.
Micross announces that Vincent M. Buffa has been appointed CEO.
Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross expands its exclusive partnership with Avalanche Technology.
Now an authorized worldwide supplier of
EPC's GaN products offered in Die Form.
Offers SiC power semiconductor devices
supported in die form thru Micross.
Now an authorized worldwide supplier of
SemiQ SiC products offered in Die Form.
Offers SiC power semiconductor devices
supported in die form thru Micross.
