Micross US and UK Holiday Closures. Read More

Micross Operations Notification - Hurricane Ian. Learn More

ON-DEMAND WEBINAR: Streamlined Turnkey Solutions for PEM Qualification and Value Added Services

View our live webinar on the advantages of turnkey solutions for PEM qualification and value added services, from experts in the field of advanced electrical and environmental qualification for microelectronics and semiconductors. In this webinar we discuss the benefits and considerations for the various turnkey service options compared with traditional models, to aid the decision process of procurement teams and electronics designers in optimizing their time-to-market and overhead costs, while mitigating risk.

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Recorded: November 1st 2022


Global Availability of LS844 Series
Low-Cost, Low-Noise, Dual JFET

PRESS RELEASE

August 31st, 2022

Micross Announces Global
Partnership with EPC Space

PRESS RELEASE

July 26th, 2022


Press & Media

Announcements

MICROSS & C-MAC Announce Partnership to Service the U.K. Aerospace & Defence Market
MICROSS & C-MAC Announce Partnership to Service the U.K. Aerospace & Defence Market

Close synergies greatly expand the hi-rel microelectronics product and service offering of both companies.

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Micross Strengthens its Component Modification Capabilities with the Consolidation of US Operations into two of its Flag Ship Next-Gen Facilities
Micross Strengthens its Component Modification Capabilities with the Consolidation of US Operations into two of its Flag Ship Next-Gen Facilities

Micross announces the combining and relocation of its component modification services (CMS) facility.

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Tradeshows

Space Tech Expo Europe
Space Tech Expo Europe

November 15-17 Stand E51

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IEEE-MAPCON
IEEE-MAPCON

December 12-16

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Announcements

Micross Components and EPC Sign Global Bare Die Distribution Agreement
Micross Components and EPC Sign Global Bare Die Distribution Agreement

Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.

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Appointment of Kenneth Kates as VP of Finance & Corporate Development
Appointment of Kenneth Kates as VP of Finance & Corporate Development

Micross announces that Kenneth Kates has been appointed VP of Finance & Corporate Development.

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Micross and SemiQ Sign Global Bare Die Distribution Agreement
Micross and SemiQ Sign Global Bare Die Distribution Agreement

Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.

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Michael Fuggini has been Appointed Sr. VP, Operations of Micross
Michael Fuggini has been Appointed Sr. VP, Operations of Micross

Micross announces that Michael Fuggini has been appointed Sr. VP.

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Vincent Buffa, Named CEO of Micross Components, Inc.
Vincent Buffa, Named CEO of Micross Components, Inc.

Micross announces that Vincent M. Buffa has been appointed CEO.

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Over 70 years of experience serving Aerospace & Defence, Space, Medical, Industrial
& Commercial customers in the U.S. and Europe.

CONTACT US

4X the Memory… Same Footprint

The Most Compact & Lowest Power Hermetic Space-Grade 64Mb MRAM

Micross & Avalanche Technology expand exclusive partnership to provide SWaP optimized hi-rel non-volatile 64Mb MRAM for space & aerospace applications.

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PRESS RELEASE

Released June 3rd, 2021

New 64Mb MRAM

One Source

Sustainment Solutions

Micross can tailor any facet of the sustainment process to fit customer’s unique requirements or entire program management for broader lifecycle management solutions.

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Sustainment Brochure

Now an authorized worldwide supplier of
EPC's GaN products offered in Die Form.

EPC

Offers SiC power semiconductor devices
supported in die form thru Micross.

Now an authorized worldwide supplier of
SemiQ SiC products offered in Die Form.

SemiQ

Offers SiC power semiconductor devices
supported in die form thru Micross.

Corfin Industries is now Micross

This combination brings together the in-depth market expertise of the two companies to further strengthen Micross’ “One Source One Solution” service offering. The Company is committed to provide an unparalleled array of high-reliability electronic product, packaging, test and modification services servicing the US, European and Global markets.

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