Micross offers a complete range of space
grade hi-rel products and services to meet
the specific requriements of space.

Aerospace & Defense

Micross offers a complete range of components,
advanced test & assembly solutions to meet the
requirements of aerospace & defence.


Micross supplies hermetic components and
bare die products to major oil and energy
customers, primarily for downhole-drilling
and solar energy.

Press Release

High-Density CCGA STT-MRAM Optimized for Space & Harsh Environments

The Micross co-fired Ceramic Column Grid Array (CCGA) package is the latest addition to our Hi-Reliability MRAM solutions for Space applications that will benefit from improved thermal stress related, electro-mechanical failures. The CCGA is currently the best solution for mitigating CTE mismatches between the package and the printed wiring assembly (PWA) for large size and/or fine pitch packages. The solder columns provide compliancy, absorb strain, and improve survivability in high shock and vibration end-use applications.

February 23, 2024

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Press Release

$134.3M DoD Contract Expands Micross’ OSAT Capabilities in the US

November 27, 2023

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Preparing Microelectronics for High-Reliability Applications

November 30, 2023

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Ruggedizing COTS Components for Hi-Rel Applications

September 28, 2023

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More News & Info

The Most Complete Provider of…
Hi-Rel Microelectronics & Services

Die & Wafer

The World’s Largest Franchised Offering of Wafer, Die & Value Added Services

  • Die & Wafer Distribution
  • Thinning, Saw, Sort, Inspect
  • Wafer Bumping
  • Long Term Die/Wafer Storage
  • EOL Die Sustainment (EDSP)
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Hi-Rel Products

QML Certified Supplier for MIL-PRF-38535, MIL-PRF-38534, & MIL-PRF-19500

  • Memory, Analog, Logic, RF, Power
  • CSP/Plastic & Hermetic Package
  • ASICs, Hybrids, MCMs, PCBs Design
  • Advanced Packaging, 2.5/3D HI
  • Diodes & Data Bus Products
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Testing & Qualification

DMEA Trusted Source & The Most Complete End-to-End Microelectronic Services

  • Counterfeit Mitigation
  • PEMS Qualification & Upscreening
  • Component Test/Inspection & Qualification
  • RF & Digital, Electrical & Environmental Testing
  • Burn-In & Mechanical Reliability Testing
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Component Modification

Leader in Component Modification with Best-in-Class Proprietary Processes

  • BGA Reballing & Robotic Hot Solder Dip
  • Trim, Form, Reconditioning
  • Lead Attach
  • CGA Interconnect
  • Marking, Labeling, & Kitting
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EOL/DMSMS Sustainment

Complete Program Sustainment from Initial Production through Post-EOL

  • Original Qualified Products
  • Product Recreation
  • Form-Fit-Function Equivalent
  • BOM Monitoring & Reporting
  • Supplier Managed Inventory
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Local Support… Worldwide
Operations, Engineering, & Field Support

Field Support


One Source
One Solution

News & Info

Trade Shows View all

Satellite 2024

March 19-21

Booth #1854

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March 19-20

Booth #518

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IMAPS Medical Workshop 2024

March 21-22

Fort McDowell, AZ

More info

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