Micross US and UK Holiday Closures. Read More

New Release: 1Gb MRAM!

Offering the Highest Density Hi-Rel Non-Volatile Memory in the
Most Compact & Lowest Power Package

More than 64X the density of our initial 16Mb MRAM,
with an improved bit density of 2.844Mb/mm2 vs 163.84Kb/mm2.

PRESS RELEASE

PRODUCT PAGE


September 14th, 2021

Webinar Recording

"The Supply Chain Storm:
Navigating EOL & DMSMS"

VIEW RECORDING

Webinar held August 19th, 2021

DSEI 2021 - London, Sept. 14-17

Meet with our product experts and executives for your program needs

SCHEDULE A MEETING

Press & Media

Announcements

MICROSS & C-MAC Announce Partnership to Service the U.K. Aerospace & Defence Market
MICROSS & C-MAC Announce Partnership to Service the U.K. Aerospace & Defence Market

Close synergies greatly expand the hi-rel microelectronics product and service offering of both companies.

Read more

Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications

Micross expands its exclusive partnership with Avalanche Technology.

Read more

___________________________

Micross & Avalanche Partner to Offer the Smallest and Lowest Power Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross & Avalanche Partner to Offer the Smallest and Lowest Power Hi-Rel Non-Volatile Memory for Aerospace Applications

Micross announces an exclusive partnership with Avalanche Technology.

Read more

Micross Strengthens its Component Modification Capabilities with the Consolidation of US Operations into two of its Flag Ship Next-Gen Facilities
Micross Strengthens its Component Modification Capabilities with the Consolidation of US Operations into two of its Flag Ship Next-Gen Facilities

Micross announces the combining and relocation of its component modification services (CMS) facility.

Read more

Tradeshows

DSEI Show, London
DSEI Show, London

September 14 - 17, 2021 Stand: H7-625

Read more

Announcements

Micross Components and EPC Sign Global Bare Die Distribution Agreement
Micross Components and EPC Sign Global Bare Die Distribution Agreement

Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.

Read more

Appointment of Kenneth Kates as VP of Finance & Corporate Development
Appointment of Kenneth Kates as VP of Finance & Corporate Development

Micross announces that Kenneth Kates has been appointed VP of Finance & Corporate Development.

Read more

___________________________

Micross and SemiQ Sign Global Bare Die Distribution Agreement
Micross and SemiQ Sign Global Bare Die Distribution Agreement

Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.

Read more

Michael Fuggini has been Appointed Sr. VP, Operations of Micross
Michael Fuggini has been Appointed Sr. VP, Operations of Micross

Micross announces that Michael Fuggini has been appointed Sr. VP.

Read more

___________________________

Vincent Buffa, Named CEO of Micross Components, Inc.
Vincent Buffa, Named CEO of Micross Components, Inc.

Micross announces that Vincent M. Buffa has been appointed CEO.

Read more

Corfin Industries Is Now Micross
Corfin Industries Is Now Micross

Micross announces further progress in its strategic integration with Corfin Industries, LLC.

Read more

Over 70 years of experience serving Aerospace & Defence, Space, Medical, Industrial
& Commercial customers in the U.S. and Europe.

CONTACT US

4X the Memory… Same Footprint

The Most Compact & Lowest Power Hermetic Space-Grade 64Mb MRAM

Micross & Avalanche Technology expand exclusive partnership to provide SWaP optimized hi-rel non-volatile 64Mb MRAM for space & aerospace applications.

LEARN MORE

PRESS RELEASE

Released June 3rd, 2021

New 64Mb MRAM

One Source

Sustainment Solutions

Micross can tailor any facet of the sustainment process to fit customer’s unique requirements or entire program management for broader lifecycle management solutions.

LEARN MORE

Sustainment Brochure

Now an authorized worldwide supplier of
EPC's GaN products offered in Die Form.

EPC

Offers SiC power semiconductor devices
supported in die form thru Micross.

Now an authorized worldwide supplier of
SemiQ SiC products offered in Die Form.

SemiQ

Offers SiC power semiconductor devices
supported in die form thru Micross.

Corfin Industries is now Micross

This combination brings together the in-depth market expertise of the two companies to further strengthen Micross’ “One Source One Solution” service offering. The Company is committed to provide an unparalleled array of high-reliability electronic product, packaging, test and modification services servicing the US, European and Global markets.

READ MORE