ORLANDO, Florida, June 23, 2017 – Micross is pleased to announce the appointment of Carey Hobbs as Director of Corporate Quality. In this newly created role, Carey is charged with defining & directing global quality and process improvements across all operational areas & locations to further improve performance and increase…

Orlando, FL, April 27, 2017 - Micross is pleased to announce that they have been awarded a contract for National Aeronautics and Space Administration (NASA) Goddard Space Flight Center on WFIRST to provide Ceramic Column Grid Array (CCGA) 20/80 Sn/Pb with copper spiral as reinforcement and 10/90 Sn/Pb column qualification…

ORLANDO, Florida, April 17, 2017 - Micross, headquartered in Orlando, FL is pleased to announce a new appointment within the company's senior management team. William P. (Willy) Bowman has joined Micross in the role of General Manager of Silicon Turnkey Solutions (STS), A Micross Company located in Milpitas, California. Read…

Orlando, FL, April 3, 2017 - Micross is pleased to announce the appointment of Greg Overend, a key addition to the Business Development Team. In this role, he'll be focused primarily on expanding Micross' assembly subcontract services. Customers today are taking full advantage of Micross’ breadth of capabilities which support…

Orlando, FL, March 21, 2017 - Micross is pleased to announce that a new state-of-the-art fabrication line for its column grid array (CGA) technology will be installed at its Micross Advanced Interconnect Technology (Micross AIT) ITAR-registered facility in Research Triangle Park, NC in 2017, bringing this proven, high-reliability interconnect technology…

Orlando, FL, March 13, 2017 – Micross today announced that it has secured AS9100 Rev. C / ISO9001:2008 certification at its premier wafer bumping and wafer-level packaging research & fabrication facility, Micross Advanced Interconnect Technology, LLC (Micross AIT) located in Research Triangle Park, NC. Read more

Orlando, FL, March 13, 2017 – Micross today announced that it has secured AS9100 Rev. C / ISO9001:2008 certification at its premier wafer bumping and wafer-level packaging research & fabrication facility, Micross Advanced Interconnect Technology, LLC (Micross AIT) located in Research Triangle Park, NC. Read more

Sunnyvale, California - January 10, 2017 - GSI Technology, Inc. (Nasdaq: GSIT), a provider of high performance semiconductor devices, today announced a services engagement with Silicon Turnkey Solutions (STS), a Micross Company, targeted at aerospace and defense applications. This engagement will leverage the combined strengths and expertise from both companies—GSI's…

ORLANDO, Florida, October 5, 2016 – Micross Components, Inc. (“Micross”) headquartered in Orlando, Florida is pleased to announce the strategic acquisition of RTI International’s Microsystem Integration and Packaging (“MIP”) Group, one of the premier wafer bumping and wafer level packaging research and fabrication facilities in the United States, servicing commercial…

ORLANDO, Florida, September 7, 2016 – Micross Components (“Micross”) headquartered in Orlando, FL is pleased to announce the appointment of Richard Gibbs as Managing Director of Micross Components Ltd. and President of Micross Components France. Mr. Gibbs will be based in the Micross Norwich facility and will be a key…