Micross Components Acquires SemiDice, Inc.
Micross Components, a leading global provider of high-reliability die & wafer products, and value added services, acquires Semi Dice, Inc. The combination creates the most comprehensive portfolio of end-to-end high-reliability die and wafer solutions and services for the aerospace, defense, medical, and industrial markets.
Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross expands its exclusive partnership with Avalanche Technology.
Micross & Avalanche Partner to Offer the Smallest and Lowest Power Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross announces an exclusive partnership with Avalanche Technology.
Micross Strengthens its Component Modification Capabilities with the Consolidation of US Operations into two of its Flag Ship Next-Gen Facilities
Micross announces the combining and relocation of its component modification services (CMS) facility.
Micross Components and EPC Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.
Appointment of Kenneth Kates as VP of Finance & Corporate Development
Micross announces that Kenneth Kates has been appointed VP of Finance & Corporate Development.
Micross and SemiQ Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.
Michael Fuggini has been Appointed Sr. VP, Operations of Micross
Micross announces that Michael Fuggini has been appointed Sr. VP.
Vincent Buffa, Named CEO of Micross Components, Inc.
Micross announces that Vincent M. Buffa has been appointed CEO.
Corfin Industries Is Now Micross
Micross announces further progress in its strategic integration with Corfin Industries, LLC.
Now an authorized worldwide supplier of
EPC's GaN products offered in Die Form.
Offers SiC power semiconductor devices
supported in die form thru Micross.
Now an authorized worldwide supplier of
SemiQ SiC products offered in Die Form.
Offers SiC power semiconductor devices
supported in die form thru Micross.
