Webinar
Chiplets - Optimized Device Integration, SWaP Performance & Time-to-Market
In this webinar, we explore how Chiplets efficiently address today’s market needs, highlight the key points to be considered with a Chiplet solution, and provide insight into the current state of Chiplets, which have not settled on one industry-wide standard for interconnects, communication protocols, and packaging. Experts in BEOL processing, advanced 2.5/3D heterogenous integration, testing, and component packaging present the latest developments, standards, protocols, and Chiplet design methodology. Gain deep insight into the considerations and best practices in leveraging the value and performance of Chiplets for high-reliability systems.
Recorded May 1, 2025
View RecordingThe Most Complete Provider of…
Hi-Rel Microelectronics & Services
Die & Wafer
The World’s Largest Franchised Offering of Die, Wafer & Value Added Services
- Die & Wafer Distribution
- Thinning, Saw, Sort, Inspect
- Wafer Bumping
- Long Term Die/Wafer Storage
- EOL Die Sustainment (EDSP)
Hi-Rel Power
Leader in Power Management Solutions for Hi-Rel and Space Applications
- Aerospace & Defense Hybrid DC-DC Converters
- Space-Grade Hybrid & PCB DC-DC Converters
- EMI Filters
- Discrete Diodes
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Hi-Rel Components
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- Memory, Analog, Logic & RF/mW
- CSP/Plastic & Hermetic Package
- ASIC Design, Wafer Level Packaging, MCMs
- Advanced Packaging, 2.5/3D Heterogeneous Integration
- MIL-STD-1553 and Data Bus Couplers & Harnesses
Testing & Qualification
DMEA Trusted Source & an Extensive Array of Testing Services
- Counterfeit Mitigation
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- RF & Digital, Electrical & Environmental Test
- Burn-In, ACBI & Mechanical Reliability Test
Component Modification
Leader in Component Modification with Best-in-Class Proprietary Processes
- BGA Reballing & Robotic Hot Solder Dip
- Trim, Form, Reconditioning
- Lead Attach
- CGA Interconnects
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EOL/DMSMS Sustainment
Complete Program Sustainment from Initial Production through Post-EOL
- Original Qualified Products
- Product Recreation
- Form-Fit-Function Equivalent
- Program Sustainment Management
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Operations, Engineering, & Field Support
