Leading Global Source for Bare Die, Wafer & Value-Added Services
Innovative Next-Gen Packaging Solutions
Providing Full Assembly Services plus one-source for all of your packaging needs
Reballing, Lead Attach & Column Attach to Suit Your Application and Technology
World’s Leading 3rd Party Qualification & Production Testing of FPGA & VLSI ASIC’s
Decades of experience qualifying the most complex packages and devices
Level I (Component) and Level II (System) Qualification
Industry’s broadest product lines, with more than 1,100 standard DLA/DSCC-certified SMD Products
Global Leader delivering the most comprehensive range of hi-reliability products & services available from any one source.
Visit Micross @ Hall C5 Stand 436 electronica Munich Nov. 13-16
Visit Micross @ Booth 8, June 26-28, College Park, MD
Micross is pleased to announce a new appointment, Marshall (Mac) Blythe has joined Micross in the role of General Manager of Component Modification Services (CMS) located in Hatfield, PA.
Micross Advanced Interconnect Technology Facility in Raleigh, NC
Micross Component Modification Services Facility in Hatfield, PA
Micross is pleased to announce the appointment of Anna Oudodova as Director of Human Resources.