Leading Global Source for Bare Die, Wafer & Value-Added Services
Innovative Next-Gen Packaging Solutions
Providing Full Assembly Services plus one-source for all of your packaging needs
Reballing, Lead Attach & Column Attach to Suit Your Application and Technology
World’s Leading 3rd Party Qualification & Production Testing of FPGA & VLSI ASIC’s
Decades of experience qualifying the most complex packages and devices
Level I (Component) and Level II (System) Qualification
Industry’s broadest product lines, with more than 1,100 standard DLA/DSCC-certified SMD Products
Global Leader delivering the most comprehensive range of hi-reliability products & services available from any one source.
Visit Micross @ Booth 312, May 30-31, San Diego, CA www.ectc.net
Micross is pleased to announce the appointment of Anna Oudodova as Director of Human Resources.
Micross announces Chloe Smith, Member of Parliament for Norwich North had visited for a tour of facility and to meet staff.