Now an authorized worldwide supplier of
EPC's GaN products offered in Die Form.
Offers SiC power semiconductor devices
supported in die form thru Micross.
Now an authorized worldwide supplier of
SemiQ SiC products offered in Die Form.
Offers SiC power semiconductor devices
supported in die form thru Micross.
Micross Components and EPC Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.
Christine Ortiz has been Appointed VP, HR of Micross
Micross announces that Christine Ortiz has been appointed VP.
Micross Components and SemiQ Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.
Michael Fuggini has been Appointed Sr. VP, Operations of Micross
Micross announces that Michael Fuggini has been appointed Sr. VP.
Vincent Buffa, Chairman of Micross Holdings, Named CEO of Micross Components, Inc.
Micross announces that Vincent M. Buffa has been appointed CEO.
Corfin Industries Is Now Micross
Micross announces further progress in its strategic integration with Corfin Industries, LLC.
Micross Components and EPC Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.
Michael Fuggini has been Appointed Sr. VP, Operations of Micross
Micross announces that Michael Fuggini has been appointed Sr. VP.
Micross Components and SemiQ Sign Global Bare Die Distribution Agreement
Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.
Vincent Buffa, Chairman of Micross Holdings, Named CEO of Micross Components, Inc.
Micross announces that Vincent M. Buffa has been appointed CEO.
Corfin Industries Is Now Micross
Micross announces further progress in its strategic integration with Corfin Industries, LLC.
Micross Advanced Interconnect Technology Receives DMEA Microelectronics Trusted Source Certification
Micross AIT can now serve designated Trusted Programs as a post-CMOS processing services provider