Adv. Interconnect Tech. - Raleigh, NC

Micross AIT, in Raleigh, North Carolina, offers advanced packaging and 3D integration solutions that enable higher-performance systems with decreased size, weight, and power (SWaP). Micross Raleigh houses an ITAR-registered microfabrication facility that allows us to provide development, custom (flexible) prototyping and production services for our customers. We provide a comprehensive array of advanced interconnect technologies for realizing your next-generation electronic systems.

Micross AIT is accredited by the Defense Microelectronics Activity (DMEA) as a Microelectronics Trusted Source provider for Post CMOS Processing Services (Category 1A).

Advanced Interconnect Technologies


(919) 248 1800

Products & Services

Wafer Bumping & WLP

Supporting wafer sizes up to 200mm with established and proven WLP processes and flexibility to tailor unique solutions

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2.5 & 3D Heterogeneous Integration

Accessible through joint development projects

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Novel Microfabrication & MEMS

Wafer-level vacuum packaging, monolithic device integration, 3D microstructures for vacuum microelectronics

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