From fine pitch components (tolerances as low as .4 mm) to complex mixed-pitch patterns, Micross provides a level of precision rarely matched in the industry. No matter what stage of development you’re in, we can get your project to the next phase.

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As more elaborate components have populated more complex PCBs, we’ve enhanced our services, added new capabilities, educated our staff and upgraded our tools. We’re constantly improving to meet the needs of our customers, their devices and their markets; to provide each of our clients with a path from concept to completion.

We specialize in complex projects involving package-on-package, LGA, QFN, CSP and other components that present real challenges and we keep an IPC-A-610 certified trainer on staff, and adhere to the IPC-7711/7721 rework standards defined by the IPC. 

We insist on working with the best tools and the right methods, like employing compressed nitrogen to reduce oxidation during rework performed on one of our nine rework stations. This critical advantage is especially important for rework performed on fine-pitch components, prototypes, expensive or irreplaceable PCBs, or devices that demand reliability.

We develop clearly defined and repeatable processes to make rework as dependable as the original manufacture and to make it easier to perform the same operations on any future projects.

During and after rework, we inspect what we’ve done using tools like the Vertex 130KV X-Ray Inspection System and the Technolab BGA Inspector Endoscope, completing a 4-point inspection on each component we place. For some projects, we can also perform 5D X-ray, used to locate and address the most difficult manufacturing and reworking issues.

We modify complex prototypes to improve or alter a board’s function, giving developers a chance to determine if their modifications are working before moving to the next stage of prototype development or manufacturing.

Technolab BGA Inspector Endoscope

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