- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
When the Original Die is Not Available, Micross Can Produce a Form-Fit-Function Recreation
With the broadest access to die, Micross will source a functionally equivalent die or component. Interposers connect the I/O of the die to the device’s board-level interconnect, creating an exact drop-in-replacement for the existing board socket. The device is then tested to the defined requirements to ensure reliability and prepared for PCB assembly via component modification services.
Source Functionally Equivalent Die
Micross will procure and store die in secure & environmentally controlled die/wafer banks.
- Exclusive access to largest base of die manufacturers
- Lot Acceptance Testing
- Wafer Test
- Long-Term Die/Wafer Storage
Die & Wafer Processing
Die is prepared for Packaging & Assembly
- Wafer Bumping
- Wafer Sawing
- Die Plating
- Pick & Place
- Visual Inspection
- Radiation Testing & Qualification
Packaging & Assembly
An interposer is used to create an exact drop-in-replacement
- Precision Die Attach: Epoxy, Eutectic, Lead, Lead-free Solder and Thermal Compression
- Advanced Interconnect: Solder bumping, Cu pillar, Cu-based microbumps & assembly
- 3D Integration Technology: TSV, TGV, Si interposers, Redistribution Layers (RDLs)
- Hermetic Ceramic & Metal Can: gull wing, QFP, PGA, flatpack, formed lead flatback
- Wire Bond: Au & Al Wire, Ball/Wedge Bonding, Wedge/Wedge, Heavy Gauge Wedge/Wedge
- Plastic: CSP/BGA/LGA/QFN & Qualified PEMs
- Patented PADS fluxless assembly process
- Lid Seal/Encapsulation
- Epoxy, solder, resistance weld, parallel seam seal
- Marking/lead finishing