- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Complete Life-Cycle Management
Micross’ decades of proven success, unparalleled knowledge & extensive capabilities extend the life cycle of products for critical EOM needs with a growing product continuation portfolio.
OEMs & CMs
Fortify your supply chain & ensure a continuous supply of components
throughout the entire life-cycle of your program. Micross will provide
long-term storage for bare die and materials, and will process, package,
and test devices as needed.
ODMs
Micross enables you to maintain your legacy portfolio and refocus
product line resources by utilizing our world-class value-added die
handling and packaging services to manufacturer your devices.
The Micross Advantage
- Secure Atmosphere & Temperature Controlled Storage Environments
- Best-in-Class Capabilities in Die/Wafer Processing, and Component Packaging, Assembly, Test, and Qualification
- Exclusive Access to Largest Base of Die Manufacturers
- Micross is Uniquely Positioned to Procure a LTB of Available Die/Wafers through our EDSP Program
- Eliminate the Need for Costly Redesign & Re-qualification by Utilizing Original Qualified Die
- Micross Maintains an Authorized Chain of Custody
Product Life Extension with EDSP
EDSP for OEMs & CMs
Consignment / Pay-On-Demand
Micross purchases inventory with customer agreement to purchase inventory ordered over agreed annual distribution plans.
- We’ll buy the required number of wafer/die for the full life of the program
- We’ll hold die/wafer in a secure long-term nitrogen & atmosphere controlled environment, for up to 20 years or more
- We’ll provide fully processed die on-demand, or as scheduled
- Additionally, we provide die packaging, qualification, and screened components as scheduled
- You will only be billed when product is shipped to you
Benefits
- Ensure the availability of devices enabling program life-cycle extension
- No additional NRE or storage costs
- Improve overhead margins with reduced inventory carrying costs
- Date codes are assigned as parts are packaged
- Simplifies re-qualification process by utilizing the original die & materials
Pre-Pay
Customer purchases inventory in advance and Micross provides just-in-time delivery as needed or over agreed annual distribution plan.
- Customer buys the required number of wafer/die for the full life of the program
- For an annual storage fee & long-term agreement, we’ll hold die/wafer in a secure long-term nitrogen & atmosphere controlled environment, for up to 20 years or more
- We’ll provide fully processed die on-demand, or as scheduled
- You will only be billed for shipping & handling and any additional processing ordered, when product is shipped to you
Benefits
- Lock in long-term product pricing, and only pay for storage, shipping, and additional processing if added
- Date codes are assigned as parts are packaged
- Simplifies re-qualification process by utilizing the original die & materials
EDSP for ODM Suppliers
Micross Distribution & Contract Manufacturing Services
You maintain your customer relationships, while Micross holds your die/wafer on consignment for an annual carrying fee, and provides die/wafer processing and packaged part production as needed.
- Extend Product Life-Cycle, eliminate overhead & inventory carrying costs, and maintain customer relationships with contracted supply chain sustainment services through Micross
- Maintain availability of legacy devices, and refocus resources to newer products
- ODM provides die/wafer to be held in a secure long-term nitrogen & atmosphere controlled environment, for up to 20 years or more
- We’ll provide fully processed die/wafer and packaged parts to the ODM/supplier on-demand or as scheduled to the ODM, or we’ll drop-ship to the customer as contracted
- You will only be billed when product is shipped to you
Benefits
- Free up capacity for new higher turn & profit product production
- Eliminate slow moving inventory
- Maintain product availability for your customers
- Date codes are assigned as parts are packaged
- Simplifies re-qualification process by utilizing the original die & materials
Flyer - Micross EOL Die Sustainment Program
Webinar - Demystifying Semiconductor Die Procurement