To protect bare die during shipment, it is critically important to choose the right supply form and packaging. A combination of factors, including movement within the container, topside surface contact, electro-static discharge (ESD) and even exposure to air, can damage the product, reducing yields during assembly.
As packaging experts, we can help you choose the supply form that best meets your manufacturing needs while protecting your bare die from corrosion and ESD. We offer a wide variety of shipment options, including:
- Wafer sawn on foil (sawn is optional)
- Wafer on foil with visual defects inked
- Waffle pack (conductive or non-conductive)
- Gel pack (adhesive)
- Tape on reel
We also give you the option of customizing your supply form to meet a specific manufacturing process. For example, tape on reel is ideal for use with automated pick-and-place machines. Or, if you desire, we can store your products in our die bank until they’re needed on the production line.
As your trusted die supplier, we will see to it that your products are (1) stored and transported safely and (2) arrive in a form that that is suitable for your manufacturing process.