- Die & Wafer
- +Supplier Line Card
- Alliance Memory
- Analog Devices
- Apogee Semiconductor
- Analog Power
- Avalanche Technology
- Central Semiconductor
- Diodes Incorporated
- Cypress
- Everspin Technologies
- Interfet
- International Rectifier
- ISOCOM Limited
- ISSI
- Knowles
- Linear Integrated Systems
- MACOM Technology
- Microchip
- Micron Technology
- NXP Semiconductors
- On Semi
- Renesas
- Samsung Semiconductors
- SemiQ Inc.
- Semicoa
- Texas Instruments
- Transys
- Vishay
- VPT Components
- +Quick Turn Services
- +Wafer Processing
- +EOL/DMSMS Sustainment
- +Component Design & Packaging
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Multi-Chip Modules (MCMs)
- Wafer Bumping & WLP
- Design, Packaging & Assembly
- Assembly Services
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- +Supplier Line Card
ISSI is a technology leader that designs, develops and markets high performance integrated circuits; high speed & low power SRAM; low & medium density DRAM and also designs and markets NOR Flash products.
Micross working together with Integrated Silicon Solution, Inc. offers bare die for Multi-Chip Module and hybrid circuit applications as well as memory technologies driven by demands for lower power, higher density, faster speeds and lower cost for volume programs.
- Long-Term Commitment to SRAM
- Possible temp ranges available are -40°C to +85°C, -40°C to +105°C, and -40°C to +125°C
- Manufactures products that meet the highest standards for reliability and performance
- Micross & ISSI collaborate to offer an extensive range of capabilities to support the Consumer, Industrial, Medical and Aerospace & Defense markets
KGD and Wafer Solutions
High Speed and Low Power Die & Wafer Products
Features:
- Low to Medium Density SDRAM's: 16Mb-512Mb, SDR, DDR and DDR2
- Broadest Portfolio of SRAM's and PSRAM's in the Industry
- Long Product Life - 7 to 10 Years
- KGD Test Flow Includes Wafer Level Burn-In & Speed Sort