Leading Global Source for Bare Die, Wafer & Value-Added Services

One Solution, One Source for your Bare Die and Wafer needs

Micross is the largest worldwide value-added bare die processor and distributor with a comprehensive array of capabilities to fully process wafers; from wafer saw to wafer bumping for your entire bill of materials. Whether a commercial product or your own die design, we will process wafer product to your exact specifications and choice of end supply form.

Over the years, Micross has developed and maintained key relationships with many of the leading semiconductor manufacturers providing us with the capability to offer an extensive bare die portfolio to our customers.

Wafer Mapping / Wafer Inking
Wafer Mapping / Wafer Inking
  • Conversion between industry formats
  • Inking using any electronic wafer map
Wafer Thinning
Wafer Thinning
  • Automated in-feed grinding of wafers
  • Ability to saw, sort and inspect wafers down to 20 μ
Wafer Dicing
Wafer Dicing
  • Wafer sizes up to 12” / 300 mm
  • Multi-project wafer dicing
  • ±1 μ tolerance
Die Plating / Pick & Place
Die Plating / Pick & Place
  • Automated, virtually contactless handling of singulated die
  • Compatible with all electronic wafer maps
  • Multiple bin / grade die picking
  • Safe handling of sensitive topside & 3D features
Visual Inspection
Visual Inspection
  • Acceptable Quality Level (AQL)
  • MIL-STD (commercial, military and aerospace grades)
  • Inspection via AOI equipment available
Customized Output
Customized Output
  • Sawn wafer on film-frame and ring-frame
  • Waffle pack; Gel-Pak®, Tape & Reel
  • Reconstructed wafer