$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US Press Release
Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.
The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions
November 2023 | Hi-Rel Products, Testing, and Qualification
$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Melville, NY (November 27, 2023) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic products and services for aerospace, defense, space, medical, energy, and other high-reliability applications, is pleased to announce that it has received an award under the IBAS Cornerstone RESHAPE program with a ceiling value of up to $134.3 million, with $45.6 million obligated at the time of the award. The award was made through the Department of Defense (DoD) to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions.
Realize the Leading Advantages & Best Practices of Upscreening, ASIC Design, and Hermetic Packaging for Hi-Rel Applications
Date/Time: November 30th, at 11am ET Duration: 1 Hour
Unlock the Future of High-Reliability Microelectronics… from Characterizing New ASIC Designs, to Packaging New Devices, to Up screening Existing Parts!
Commercial new space programs are increasing demand for high-reliability microelectronics, but national security concerns can limit access to U.S. based advanced semiconductor process nodes. Those attending will learn how to navigate these uncertain times through innovative microelectronics design, packaging, testing, and qualification. They will learn the latest options and best practices for cost-optimized hi-reliability microelectronics for demanding program requirements.
Micross is the most complete provider of advanced microelectronic services and component, die and wafer solutions. With the broadest authorized access to die & wafer suppliers, an extensive portfolio of hi-rel power, RF, optoelectronics, memory, data bus, logic, and SMD/5962 qualified products, and the most comprehensive advanced packaging, assembly, modification, upscreening, and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions, from bare die, to fully packaged devices including hermetic ICs/MCMs, PEMs, ASICs, FPGAs, and PCBs, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical, energy, communications, and industrial markets.