November 2023: Hi-Rel Products, Testing, and Qualification

The Most Complete Provider of Advanced Microelectronic Services 
and Component, Die & Wafer Solutions

November 2023 | Hi-Rel Products, Testing, and Qualification

New Contracts

$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US

Melville, NY (November 27, 2023) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic products and services for aerospace, defense, space, medical, energy, and other high-reliability applications, is pleased to announce that it has received an award under the IBAS Cornerstone RESHAPE program with a ceiling value of up to $134.3 million, with $45.6 million obligated at the time of the award. The award was made through the Department of Defense (DoD) to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions.

Webinar

Realize the Leading Advantages & Best Practices of Upscreening, ASIC Design, and Hermetic Packaging for Hi-Rel Applications

Date/Time: November 30th, at 11am ET
Duration: 1 Hour

Unlock the Future of High-Reliability Microelectronics… from Characterizing New ASIC Designs, to Packaging New Devices, to Up screening Existing Parts!

Commercial new space programs are increasing demand for high-reliability microelectronics, but national security concerns can limit access to U.S. based advanced semiconductor process nodes. Those attending will learn how to navigate these uncertain times through innovative microelectronics design, packaging, testing, and qualification. They will learn the latest options and best practices for cost-optimized hi-reliability microelectronics for demanding program requirements.

New Space-Grade CGA Memory

New STT-MRAM CGA Option

For deep space customers looking for added reliability and robustness, we've extended our space-grade STT-MRAM offering to include a Column Grid Array (CGA) option for the 4Gb and 1Gb ceramic devices.

CGA is an enabling interconnect technology for high reliability applications, mitigating thermal and mechanical stresses, and enabling superior performance over standard BGA Interconnects.