Part Number |
Memory Type |
Density |
Configuration |
Voltage |
Speed |
Package Material |
Radiation Hardness |
MYXxxSMS0xGPS08PB-4108/x |
STT-MRAM |
2/4/8Gb |
4Gb x 2 |
2.7V - 3.6V, 0.090V – 1.05V |
54MHz, 108 Mhz |
Plastic BGA |
Qualified Encapsulated Device (QED), Rad-Tolerant, Non-Rad |
MYXxxSMS04GP32xxx-45/x |
STT-MRAM |
4Gb |
128M x 32 |
2.7V - 3.6V |
45ns |
Ceramic LGA, Ceramic BGA |
Rad-Hard, Rad-Tolerant, Non-Rad |
MYXxxSMS04GP32PB1-45/x |
STT-MRAM |
4Gb |
128M x 32 |
2.7V - 3.6V |
45ns |
Plastic BGA |
Qualified Encapsulated Device (QED), Rad-Tolerant, Non-Rad |
MYXxxSMS01GP32xxx-45/x |
STT-MRAM |
1Gb |
32M x 32 |
2.7V - 3.6V |
45ns |
Ceramic LGA, Ceramic BGA |
Rad-Hard, Rad-Tolerant, Non-Rad |
MYXxxSMS01GP32PB1-45/x |
STT-MRAM |
1Gb |
32M x 32 |
2.7V - 3.6V |
45ns |
Plastic BGA |
Qualified Encapsulated Device (QED), Rad-Tolerant, Non-Rad |
MYXxxSMSxxxxPxxxxx-xx/x |
STT-MRAM |
64Mb |
4M x 16 |
2.7V - 3.6V |
45ns |
Ceramic LGA, Ceramic BGA |
Rad-Hard, Rad-Tolerant, Non-Rad |
MYXXXXX16MP16PB‐45/XX |
STT-MRAM |
16Mb |
2M x 8 |
2.7V - 3.6V |
45ns |
Plastic BGA |
Qualified Encapsulated Device (QED), Rad-Tolerant, Non-Rad |
MYXxxSMSxxxxPxxxxx-xx/x |
STT-MRAM |
16Mb |
2M x 8 |
2.7V - 3.6V |
45ns |
Ceramic LGA, Ceramic BGA |
Rad-Hard, Rad-Tolerant, Non-Rad |
MYXXXXX16MP8PB‐45/XX |
STT-MRAM |
16Mb |
1M x 16 |
2.7V - 3.6V |
45ns |
Plastic BGA |
Qualified Encapsulated Device (QED), Rad-Tolerant, Non-Rad |
MYXxxSMSxxxxPxxxxx-xx/x |
STT-MRAM |
16Mb |
1M x 16 |
2.7V - 3.6V |
45ns |
Ceramic LGA, Ceramic BGA |
Rad-Hard, Rad-Tolerant, Non-Rad |