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The Most Complete Provider of Advanced Microelectronic Services
and Component, Die & Wafer Solutions
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June 2025 | Advanced Packaging, Photonic ICs, & Chiplets This issue highlights the transformative role of advanced packaging, photonic integrated circuits (PIC), and chiplets in optimizing performance and device integration, while reducing time-to-market. We also tackle the critical challenge of obsolescence management in the fast-evolving semiconductor landscape. Connect with our product experts and executives in person to discuss your high-reliability requirements, see the list of conferences where we'll be exhibiting.
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Photonic Integrated Circuits (PIC)
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Accelerating Computing with Light-Speed Solutions through Advanced Packaging Micross is a leader in advanced packaging and integration technology, including Photonic Integrated Circuit integration supporting AI datacenter interconnect and photonic computing applications. With decades of experience and investment in wafer level packaging (WLP), interposer fab and 3D Heterogeneous Assembly. Micross is accredited by the DMEA as a DoD Category 1A Trusted IC Supplier for the leading edge of computing. Speak with an expert to launch your next program.
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Chiplets - Optimized Device Integration, SWaP Performance & Time-to-Market Recorded: May 2nd, 2025
Duration: 1 Hour In this webinar, we explore how Chiplets efficiently address today’s market needs, highlight the key points to be considered with a Chiplet solution, and provide insight into the current state of Chiplets, which have not settled on one industry-wide standard for interconnects, communication protocols, and packaging. Experts in BEOL processing, advanced 2.5/3D heterogenous integration, testing, and component packaging present the latest developments, standards, protocols, and Chiplet design methodology. Gain deep insight into the considerations and best practices in leveraging the value and performance of Chiplets for high-reliability systems.
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Navigating the Obsolescence Challenge: Strategies for Success In the semiconductor sector, managing obsolescence is an ongoing challenge for manufacturers. As technology evolves rapidly, older materials and components swiftly become obsolete, failing to meet market demands. This can result in supply shortages and difficulties in procuring essential parts for semiconductor devices. Various forms of obsolescence, including technological, fit, legal, and form obsolescence, pose distinct challenges that companies must navigate to remain competitive. To effectively manage obsolescence, companies need a structured obsolescence management plan, vigilant supplier monitoring, and consideration of long-term inventory purchases. For more information, read Integra's June FAQ Newsletter! Integra is a Micross Company.
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Micross will be showcasing our latest solutions for space, aerospace, defense, RF, and other hi-rel markets. Our product experts and executives will be on site to discuss your technical and program needs.
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Symposium on Counterfeit Parts and Materials June 24-26 College Park, MD
Featured Speaker:
Sultan Lilani, Director, Techincal Support & Business Development at Integra Technologies Topics Include: - Panel Discussion: Reducing Counterfeit Risk Through the Use of DoD Trusted Suppliers
- Issues Related to Counterfeit Using Used / Aged Parts - Update of Study on Detection of Aged Parts
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NSREC - Nuclear & Space Radiation Effects Conference July 14-18 Nashville, TN Booth #303
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IMS - International Microwave Symposium June 17-19, 2025 – We had a fantastic experience at the IEEE MTT-S International Microwave Symposium, showcasing our Hi-Rel RF, Microwave, and DC-DC Power solutions, and end-to-end microelectronic product and service portfolio. Thank you to everyone who visited us—we appreciate the engaging conversations and look forward to future collaborations!
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AVCOM - Advanced Component Obsolescence Management June 3-5, 2025 – We are thrilled to announce our participation in the BAE Systems, Inc. AVCOM Obsolescence Working Group, showcasing our comprehensive portfolio of DMSMS sustainment and life-cycle management services. Our commitment to supporting mission-critical systems is unwavering, and we are proud to contribute our expertise to this vital initiative. Additionally, we are excited to have taken part in the following panels and presentations:
Featured Panelist: Sultan Lilani, Director, Techincal Support & Business Development at Integra Technologies Panel Discussion: - Proactive DMSMS Functions in Life-Cycle Management
Featured Presenter: Jim Althoff, Business Development at Micross Presentation: - Integrated Sustainment: Onshore Semiconductor Solutions for a Resilient Defense Supply Chain
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ECTC - Electronic Components and Technology Conference May 28-29, 2025 – We had an exciting week exhibiting at ECTC, showcasing our cutting-edge component packaging and advanced 2.5/3D heterogeneous integration capabilities! Thank you to all who stopped by, and to our incredible product experts & executives for supporting this amazing event.
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