New Release: 1Gb QED MRAM!
Qualified Encapsulated Device (QED) to NASA Specifications
Micross' space-grade 1Gb QED MRAM is screened and qualified
to NASA's EEE-INST-002 requirements for Level-2 products
September 29th, 2021
New 1Gb MRAM
The Highest Density, Lowest Power Hi-Rel Non-Volatile Memory
September 14th, 2021
"The Supply Chain Storm:
Navigating EOL & DMSMS"
Webinar held August 19th, 2021
Close synergies greatly expand the hi-rel microelectronics product and service offering of both companies.
Micross Expands MRAM Offering with the Most Compact & Lowest Power 64Mb Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross expands its exclusive partnership with Avalanche Technology.
Micross & Avalanche Partner to Offer the Smallest and Lowest Power Hi-Rel Non-Volatile Memory for Aerospace Applications
Micross announces an exclusive partnership with Avalanche Technology.
Micross Strengthens its Component Modification Capabilities with the Consolidation of US Operations into two of its Flag Ship Next-Gen Facilities
Micross announces the combining and relocation of its component modification services (CMS) facility.
Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.
Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.
Micross announces that Vincent M. Buffa has been appointed CEO.
Over 70 years of experience serving Aerospace & Defence, Space, Medical, Industrial
& Commercial customers in the U.S. and Europe.
Corfin Industries is now Micross
This combination brings together the in-depth market expertise of the two companies to further strengthen Micross’ “One Source One Solution” service offering. The Company is committed to provide an unparalleled array of high-reliability electronic product, packaging, test and modification services servicing the US, European and Global markets.