Micross US and UK Holiday Closures. Read More

New Release: 1Gb QED MRAM!

Qualified Encapsulated Device (QED) to NASA Specifications

Micross' space-grade 1Gb QED MRAM is screened and qualified
to NASA's EEE-INST-002 requirements for Level-2 products

PRESS RELEASE

PRODUCT PAGE


September 29th, 2021


New 1Gb MRAM

The Highest Density, Lowest Power Hi-Rel Non-Volatile Memory

PRESS RELEASE

PRODUCT PAGE

September 14th, 2021

Webinar Recording

"The Supply Chain Storm:
Navigating EOL & DMSMS"

VIEW RECORDING

Webinar held August 19th, 2021


Press & Media

Announcements

MICROSS & C-MAC Announce Partnership to Service the U.K. Aerospace & Defence Market
MICROSS & C-MAC Announce Partnership to Service the U.K. Aerospace & Defence Market

Close synergies greatly expand the hi-rel microelectronics product and service offering of both companies.

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Tradeshows

DSEI Show, London
DSEI Show, London

September 14 - 17, 2021 Stand: H7-625

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Announcements

Micross Components and EPC Sign Global Bare Die Distribution Agreement
Micross Components and EPC Sign Global Bare Die Distribution Agreement

Micross is now an authorized supplier of EPC’s GaN products offered in Die Form.

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Appointment of Kenneth Kates as VP of Finance & Corporate Development
Appointment of Kenneth Kates as VP of Finance & Corporate Development

Micross announces that Kenneth Kates has been appointed VP of Finance & Corporate Development.

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Micross and SemiQ Sign Global Bare Die Distribution Agreement
Micross and SemiQ Sign Global Bare Die Distribution Agreement

Micross is now an authorized supplier of SemiQ SiC products offered in Die Form.

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Michael Fuggini has been Appointed Sr. VP, Operations of Micross
Michael Fuggini has been Appointed Sr. VP, Operations of Micross

Micross announces that Michael Fuggini has been appointed Sr. VP.

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Vincent Buffa, Named CEO of Micross Components, Inc.
Vincent Buffa, Named CEO of Micross Components, Inc.

Micross announces that Vincent M. Buffa has been appointed CEO.

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Corfin Industries Is Now Micross
Corfin Industries Is Now Micross

Micross announces further progress in its strategic integration with Corfin Industries, LLC.

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Over 70 years of experience serving Aerospace & Defence, Space, Medical, Industrial
& Commercial customers in the U.S. and Europe.

CONTACT US

4X the Memory… Same Footprint

The Most Compact & Lowest Power Hermetic Space-Grade 64Mb MRAM

Micross & Avalanche Technology expand exclusive partnership to provide SWaP optimized hi-rel non-volatile 64Mb MRAM for space & aerospace applications.

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PRESS RELEASE

Released June 3rd, 2021

New 64Mb MRAM

One Source

Sustainment Solutions

Micross can tailor any facet of the sustainment process to fit customer’s unique requirements or entire program management for broader lifecycle management solutions.

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Sustainment Brochure

Now an authorized worldwide supplier of
EPC's GaN products offered in Die Form.

EPC

Offers SiC power semiconductor devices
supported in die form thru Micross.

Now an authorized worldwide supplier of
SemiQ SiC products offered in Die Form.

SemiQ

Offers SiC power semiconductor devices
supported in die form thru Micross.

Corfin Industries is now Micross

This combination brings together the in-depth market expertise of the two companies to further strengthen Micross’ “One Source One Solution” service offering. The Company is committed to provide an unparalleled array of high-reliability electronic product, packaging, test and modification services servicing the US, European and Global markets.

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