Space

Complete range of hermetic & non-hermetic components
for space, with end-to-end services, including
packaging, ruggedization, screening and qualification

Aerospace & Defense

Complete range of components, semiconductors, and
end-to-end services, including packaging, testing,
qualification, ruggedization, and DMSMS sustainment

Energy

Complete range of hermetic components, semiconductors,
and end-to-end services, including packaging,
ruggedization, screening and qualification

Medical

Complete range of semiconductors, hermetic components,
and end-to-end services, including packaging,
ruggedization, screening and qualification

Press Release

Micross Reinforces US Electronics Supply Chain with Modernization of Near-Shored Hi-Rel Diodes Foundry & Manufacturing Operations

Micross will be celebrating the grand re-opening of the 70,000 sq. ft. state-of-the-art high reliability diode manufacturing and foundry operations in January. The former Semtech facility was completely upgraded with the latest fab equipment, new infrastructure and cleanrooms, providing expanded capabilities for custom low-rate production as well as high volume full-rate production. Product types manufactured at this facility include Qualified Products List (QPL) and non-QPL rectifiers, transient voltage suppressors (TVS) and zener diodes in axial and surface-mount packages, all engineered for the harshest environments.

November 20, 2024

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Webinar

Applying COTS RF/Microwave in Space with Assurance

November 21, 2024

Register now

Webinar

Why MIL-STD-1553 and What’s New?

August 15, 2024

View recording

Press Release

Micross & Sital Announce Global Partnership

May 2, 2024

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Die & Wafer

The World’s Largest Franchised Offering of Wafer, Die & Value Added Services

  • Die & Wafer Distribution
  • Thinning, Saw, Sort, Inspect
  • Wafer Bumping
  • Long Term Die/Wafer Storage
  • EOL Die Sustainment (EDSP)
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Hi-Rel Products

QML Certified Supplier for MIL-PRF-38535, MIL-PRF-38534, & MIL-PRF-19500

  • Memory, Analog, Logic, RF, Power
  • CSP/Plastic & Hermetic Package
  • ASICs, Hybrids, MCMs, PCBs Design
  • Advanced Packaging, 2.5/3D HI
  • Diodes & Data Bus Products
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Testing & Qualification

DMEA Trusted Source & The Most Complete End-to-End Microelectronic Services

  • Counterfeit Mitigation
  • PEMS Qualification & Upscreening
  • Component Test/Inspection & Qualification
  • RF & Digital, Electrical & Environmental Testing
  • Burn-In & Mechanical Reliability Testing
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Component Modification

Leader in Component Modification with Best-in-Class Proprietary Processes

  • BGA Reballing & Robotic Hot Solder Dip
  • Trim, Form, Reconditioning
  • Lead Attach
  • CGA Interconnect
  • Marking, Labeling, & Kitting
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EOL/DMSMS Sustainment

Complete Program Sustainment from Initial Production through Post-EOL

  • Original Qualified Products
  • Product Recreation
  • Form-Fit-Function Equivalent
  • BOM Monitoring & Reporting
  • Supplier Managed Inventory
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News & Info

Trade Shows View all

PAINE Conference

November 12-14

Huntsville, AL

Booth TBC

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Space Tech Expo Europe 2024

November 19-21

Bremen, Germany

Booth #C40

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