Micross has the expertise to characterize and reverse engineer devices, along with broadest access to source functionally equivalent die.
Offers the Sourcing EOL/LTB Die & Wafer
Obsolescence management for OEMs when parts go EOL
- If required parts available – source/procure to support program needs with Lifetime Buy Management service - See EDSP
- If unavailable – source/procure similar commercial parts if this is an acceptable alternative for the OEM
- - Identify PIN compatible components for upscreening
- - Diminishes cost in redesigning component
- - Reduces production delays and down-time
Characterizing and Sourcing
3rd party equivalent die
- If the die is not available, but we are provided with a sample to characterize, Micross will source a functionally equivalent die and utilize our advanced capabilities to manufacture a form-fit-function packaged equivalent product to SMD and other required quality levels.
- The mechanical footprint and electrical specifications required by the application are maintained, solving DMS and avoiding costly re-designs.