- Products & Services
- +Hi-Rel ICs & Components
- DLA/DSCC Certified Products
- QML/SMD 5962
- Function
- Memory
- +Hi-Rel ICs & Components
- Optocouplers
- GaN Power Devices
- Logic Devices
- Analog
- High Temp
- Passives
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
How Can EDSP Help You?
Micross EDSP provides exact drop in replacement die or fully packaged solutions utilizing the original qualified die, thereby eliminating the need for costly requalification or design changes.
- OEMs... Micross can support your product needs past natural component life cycles.
- ODMs... Micross enables you to refocus product line resources utilizing our world-class value-added die handling and packaging services.
We would be happy to discuss your sustainment needs and how we can support your lifecycle requirements.To begin solving your sustainment needs today, please submit your information and we will contact you soon.