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The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions
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July 2022 | Micross Strengthens Die, Wafer & Hi-Rel Products Offerings
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In this issue, we're proud to announce our new global distribution partnership with EPC Space, and the further expansion of our Hi-Rel Products group with the appointments of general managers Michael Agic and Estro Vitantonio. If you missed our webinar "Optimizing Hi-Rel Electronics Design for you Application", the recording is now available! In this webinar industry experts in the field of semiconductors and advanced microelectronics packaging and assembly share their insights on the logic and rationale designers should consider. Also highlighted in this issue are the upcoming tradeshows and conferences where you can meet with our experts in person.
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Micross Announces Global Distribution Partnership with EPC Space... Expands Rad-Hard Gallium Nitride (GaN) Power Device Offering
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EPC Space produces revolutionary GaN devices that are smaller, lighter and better performing... meaning the devices have many times superior switching performance compared to silicon solutions. To complement the EPC Space discrete products, Micross will also distribute EPC Space’s family of rad hard enhancement mode GaN drivers and power stages.
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Need Bare/Processed Die or Wafers? Only Micross offers… franchised access to the largest selection, from the world’s leading semiconductor ODMs… along with the most comprehensive array of advanced processing & packaging services, including 3DHI, ASICs, FPGA’s, and MCMs, for hi-rel industrial and RF to aerospace/defense and space applications… with local support globally, from operations, engineering, and field support in North America, Europe, and Asia.
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