When Military or Space grade products are not available, Micross will recondition COTS product to OEM specifications.
Component Solutions
- Re-tin ROHS compliant parts where leaded interconnects are required
- - Robotic Hot Solder Dip
- - BGA Reballing
- Lead Attach
- - Lead Attach to ceramic or plastic Leadless Chip Carrier
- - Lead Replacement
- - CGA Attach
- Reform leads to OEM specification
- - Trim & Form
- - Reconditioning of bent or damaged leads
- Packaging
- - Lead Attach to ceramic or plastic Leadless Chip Carrier
- - Tape and Reel
- - 3D Scan
- - Bake and Package
- - Marking & Labeling
PCB Solutions
- Rework & Repair enabling Non-working qualified PCBs to be reused
- Specializing in package-on-package, LGA, QFN, CSP and other challenging components
- Adhere to IPC-7711/7721 rework standards
- 4-point inspection on each component placed
- 5D X-ray, used to locate & address the most difficult manufacturing and reworking issues
- Trace modification in inaccessible areas, under BGAs or other sensitive components
- Repair damaged traces and solder mask, incorrectly installed components, defects
- Restore pad sites for any component, including fine-pitch and variable-pitch BGAs, QFNs, and package-on-package stacks
- Removal and replacement of BGA, Micro BGA, and flip-chip, plus the majority of fine-pitch components