Micross has over 20 years of experience in safely harvesting components for board repair & re-use
- Fully automated process – No risk of bending or damaging leads.
- Micross’ harvesting process utilizes 17 rework/reflow stations
- - Heated Stage with forced, focused hot air
- - The most precise control of temperature ramp up, time at peak and ramp down
- - Eliminates potential of thermal damage to the harvested components and circuit board
Component Modification Services for Harvested Components
- Robotic Hot Solder Dip (RHSD) and BGA reballing Using SAC305 for RoHS compatible or Sn63/Pb 37 for RoHS exempt applications
- Micross has the most extensive array of next-gen equipment exceeding all process requirements of industry standards;
- - GEIA-0006 (RHSD) and IEC TS62647-4 (Reballing) guaranteeing conformance to IPC-J-STD-001 & IPC-J-STD-002
- Complete in-house electrical, environmental & mechanical testing