Micross has over 20 years of experience in safely harvesting components for board repair & re-use

  • Fully automated process – No risk of bending or damaging leads.
  • Micross’ harvesting process utilizes 17 rework/reflow stations
    • - Heated Stage with forced, focused hot air
    • - The most precise control of temperature ramp up, time at peak and ramp down
    • - Eliminates potential of thermal damage to the harvested components and circuit board

Component Modification Services for Harvested Components

  • Robotic Hot Solder Dip (RHSD) and BGA reballing Using SAC305 for RoHS compatible or Sn63/Pb 37 for RoHS exempt applications
  • Micross has the most extensive array of next-gen equipment exceeding all process requirements of industry standards;
    • - GEIA-0006 (RHSD) and IEC TS62647-4 (Reballing) guaranteeing conformance to IPC-J-STD-001 & IPC-J-STD-002
  • Complete in-house electrical, environmental & mechanical testing