- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Custom Solutions
Micross has the experience, expertise and resources at realizing solutions to address customer specific requirements. By integrating functional blocks and devices into one package, KCB is able to reduce size and weight which are critical in Satellite and Airborne applications. Further, by managing the device qualification process at the module level, KCB is able to realize reduced cost through risk reduction associated with procuring and qualifying multiple components.
Case Studies
Switch Matrix
A major Military customer needed an integrated high power switch solution to address performance and thermal issues associated with their existing discrete solution. Micross was able to design a multi-chip hybrid solution which included 15 components to realize a multi-path transceiver switch matrix. By integrating the components onto a highly thermally conductive platform, Micross was able to drastically improve the thermal management of the semiconductors in the design.
Digital Step Attenuator Module
Micross has offered digital step attenuators a single chip in package devices. A major Aerospace customer needed a serial CMOS/TTL compatible driver integrated with this attenuator. Micross stepped up to the challenge by developing and multi-layer hermetic package that integrated the serial driver with the attenuator. This reduced the overall implementation size of the discrete approach and reduced the amount of qualification needed to satisfy Class-K requirements.
GaN Amplifier Module
With the emergence of GaN transistors and MMICs, there has been an increasing desire to migrate this enabling technology to Space. KCB identified a suitable hermetic package and integrated the MMIC with it’s associated bias components into a single module, enabling the customer to develop a 25W amplifier with high efficiency with minimal external bias circuitry.
Multi-Chip Modules
Micross is able to combine its semiconductor package development experience with its ability to realize individual building blocks by integrating functional blocks and devices into one package. Micross is able to synthesize multi-layer semiconductor package designs that reduce size and weight which are critical in Satellite and Airborne applications from DC through Ka Band. Further, by managing the device qualification process at the module level, Micross is able to realize reduced cost through risk reduction associated with procuring and qualifying multiple components.
Case Studies
Ka Band Vector Modulator
Micross was able to realize an LO amplifier, a mixer/doubler, and an RF amplifier with I and Q inputs in a single leadless hermetic package. This modulator enables customers to realize seamless up-conversion in a small footprint that is ready made for space applications. This solution is also available for Ku and X band applications.
2-20 GHz Switched Amplifier
This product integrates and SPDT switch with an input limiter and broadband low noise amplifier in a 0.3” square surface mount leadless hermetic package. This product is fully screened to MIL requirements and 100% electrical tested.
X-Band Transceiver
An aerospace customer developed an x-band transceiver chip set consisting of a MMIC LNA w/digital attenuator and phase shift control and a MMIC PA with 1W PSAT. Phase control was critical as the application is Phased Array Radar. Micross was able to develop a multi-layer ceramic package that provided very precise phase repeatability; obviating the need to match sets as the entire population was well controlled.