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Considering Silicon Carbide (SiC) to Optimize Your Power System?
In-Stock Availability

SemiDice (an independent subsidiary of Micross) is distributing free samples of Coherent Silicon Carbide products. They provide power system designers solutions for the most demanding applications with unrivaled efficiency, frequency, temperature, and voltage capabilities.

Request a Free Sample

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Applying COTS RF/mW in Space with Assurance
Webinar Recording

In this webinar, industry experts in Hi-Rel RF electronics design, packaging, testing, and qualification of hybrid multi-chip modules (MCM), will provide the latest options and best practices in realizing the optimal RF/mW for space and high-reliability applications.

Recorded November 21, 2024

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Maximizing DC-DC Power Supply for Space
Webinar Recording

In this webinar, industry experts in hi-rel power electronics design, packaging, testing, and qualification of hybrid and space-grade PCB DC-DC power supplies, will provide the latest options and the best practices in realizing the optimal power suppliers for today's high-reliability applications.

Recorded May 2nd, 2024

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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Modernization of Near-Shored Hi-Rel Diodes Foundry and Manufacturing Operations
Press Release

Micross Hi-Rel Diodes facility in Reynosa, MX, less than 4 miles from the US border, was completely upgraded with the latest fab equipment, new infrastructure, and cleanrooms, providing expanded capabilities for custom low-rate production, as well as high volume full-rate production.

November 20, 2024

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MIL-PRF-38534 Screening

MIL-PRF-38534 covers screening requirements that all parts are submitted to as well as Quality Conformance Inspection consisting of one or more of Group A, B, C and D for acceptance of the design of the process and of the production lot.

MIL-PRF-38534 applies to multi-chip modules and systems such as power modules or DC-DC converters.

For more information on MIL-PRF-38534 screening and quality conformance inspection, consult the DoD document or contact Micross.

MIL-PRF-38534 Screening Requirements
Test/Inspection Screening Level MIL-STD-883-Method
Class H Class K (Space Level)
Pre-Seal Burn-In Optional Optional 1030
Nondestructive Bond Pull N/A 100% 2023
Internal Visual 100% 100% 2017
Temperature Cycle 100% 100% 1010
Constant Acceleration 100% 100% 2001
Mechanical Shock 100% 100% 2002
Particle Impact Noise Detection (PIND) N/A 100% 2020
Preburn-In-Electrical Optional 100%  
Burn-In 100% 100% 1015
Final Electrical 100% 100%  
Seal 100% 100% 1014
Radiographic N/A 100% 2012
External Visual 100% 100% 2009

Micross Hi-Rel Power has also established standard, cost-effective screening programs known as the QIRL and OM803 program. Standard "off the shelf," Space, JANTXV or JANTX level product can be designated as QIRL. These products are fully compliant with all screening and Quality Conformance Inspection (QCI) requirements of MIL-PRF-19500 for Space, JANTXV or JANTX levels. They meet the same data sheet electrical and mechanical specifications, and are produced and tested on a JANS qualified line. The OM803 screening program was developed to offer low-cost screening to our customers while using methods and conditions defined in MIL-STD-750 and MIL-STD-883. The OM803 screening program is performed on all Omnirel standard products.

Note 1: Level 2 devices- burn-in time is 48 hours minimum, Level 3 devices - burn-in time is 160 hours minimum.
Note 2: PDAs apply to burn-in and post electricals only.
Note 3: When ordering "P" level devices, the letter "P" is not marked on the device.

Engineering models are designated by the /EM suffix in the part number. Effective as of September 1, 2019, this flow applies to all DC-DC Converter models derived from the following hybrid families: ARA, ARE, AF, ART, GH, GHP, LS, LSO, M3GB, M3N, S, SF, SBB, SBI.

EM Screening Flow for DC-DC Converters
Part Number Designator /EM /CK
Compliance Level MIL-PRF-38354 N/A K Level Compliant
Screening Requirement MIL-STD-883 TM    
Temperature Range - Ambient -55°C to +85°C
Element Evaluation MIL-PRF-38534 N/A Class K
Non-Destructive Bond Pull 2023 N/A Yes
Internal Visual 2017 Micross Defined Yes
Temperature Cycle 1010 N/A Cond. C
Constant Acceleration 2001, Y1 Axis N/A 3000 Gs
PIND 2020 N/A Cond. A
Burn-In 1015 N/A 320 hrs @ 125°C (2 x 160 hrs)
Final-Electrical (Group A) MIL-PRF-38534 & Specification Ambient -55°C, +25°C, +85°C
PDA MIL-PRF-38534 N/A 2%
Seal, Find and Gross 1014 N/A Cond. CH
Radiographic 2012 N/A Yes
External Visual 2009 Micross Defined Yes
MIL-PRF-38534 Quality Conformance Inspection
MIL-PRF-38534 Group A Electrical Testing
Sub Group Parameters Quantity (Accept Number)
1 Static Tests at +25°C 116 (0)
2 Static Tests at Max. Rated Operating Temp. 76 (0)
3 Static Tests at Min. Rated Operating Temp. 45 (0)
4 Dynamic Tests at 25°C 116 (0)
5 Dynamic Tests at Max. Rated Operating Temp. 15 (0)
6 Dynamic Tests at Min. Rated Operating Temp. 45 (0)
7 Functional Tests at +25°C 116 (0)
8 Functional Tests at Max. & Min. Rated Operating Temp. 76 (0)
9 Switching Tests at +25°C 116 (0)
10 Switching Tests at Max. Rated Operating Temp. 76 (0)
11 Switching Tests at Min. Rated Operating Temp. 45 (0)
MIL-PRF-38534 Group B Testing
Sub Group Parameters Quantity (Accept Number) Class
K H
1 Physical Dimension 2 (0) X X
2 PIND 15 (0) X  
3 Resistance to Solvents 3 (0) X X
4 Internal Visual and Mechanical 1 (0) X X
5 Bond Strength:
a. Thermocompression
b. Ultrasonic or Wedge
c. Flip-Chip
d. Beam Lead		 2 (0) X X
6 Die-Shear Strength 2 (0) X X
7 Solderability 1 (0) X X
8 Seal:
a. Fine
b. Gross		 15 (0)   X
9 ESD:
a. Electrical Parameters
b. ESDS
c. Electrical Parameter		 3 (0) X X
MIL-PRF-38534 Group C Testing
Sub Group Parameters Quantity (Accept Number) Class
K H
1 Physical Dimension 2 (0) X X
2 PIND 15 (0) X  
3 Resistance to Solvents 3 (0) X X
4 Internal Visual and Mechanical 1 (0) X X
5 Bond Strength:
a. Thermocompression
b. Ultrasonic or Wedge
c. Flip-Chip
d. Beam Lead		 2 (0) X X
6 Die-Shear Strength 2 (0) X X
7 Solderability 1 (0) X X
8 Seal:
a. Fine
b. Gross		 15 (0)   X
9 ESD:
a. Electrical Parameters
b. ESDS
c. Electrical Parameter		 3 (0) X X
MIL-PRF-38534 Group D Package Related Testing
Sub Group Parameters Quantity (Accept Number)
1 Thermal Shock 5 (0)
Stabilization Bake 5 (0)
Lead Integrity 1 (0)
Seal:
a. Fine
b. Gross		 5 (0)
2 Moisture Resistance 5 (0)
3 Salt Atmosphere 5 (0)
4 Metal Package Isolation 3 (0)

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