- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
When original qualified die or components are not available, Micross has the expertise to reverse engineer devices and manufacture a form-fit-function equivalent. Micross can characterize and source fuctionally equivalent die, and package into an exact drop-in-replacement for the existing board socket.
Die Characterization & Sourcing
Expertise in characterizing and reverse engineering devices, along with the broadest access to source functionally equivalent die
More infoProduct Recreation
Source functionally equivalent die to die & wafer processing to packaging & assembly to test & inspection to component modification
More infoCOTS Up-Screening
Over 30 years experience up-screening and testing nearly all type of electronic components with a wide range of quality certifications
More info