Device Characterization

Micross provides a comprehensive array of complete Turnkey Test & Device Characterization solutions inclusive of the following capabilities:


Test Program Development
  • Multiple platform expertise
  • High-speed yield optimization
Wafer Sort/Wafer Probe
  • Up to 300mm wafer probe
Production Test
  • Full IC package testing and hybrid testing. Wafer-level testing. High-speed, multi-site delivery
Program Conversion
  • Technology migration to improve cost effectiveness

Micross’ in-house technically-advanced engineering team can support all technologies, including RF, digital, linear, analog mixed signal and memory.

+ Quote Cart Request Info Tech Support

Privacy Policy

By using this online service you accept the handling of any personal data in accordance with the Privacy Policy.