Category ▾
  • Products
  • Die & Wafer
  • Product & Services
  • Component Modifications
  • Global
Search
✕

Support

About Us

Solutions

Die & Wafer

Components & Services

Power

Component Modification

Global

Considering Silicon Carbide (SiC) to Optimize Your Power System?
In-Stock Availability

SemiDice (an independent subsidiary of Micross) is distributing free samples of Coherent Silicon Carbide products. They provide power system designers solutions for the most demanding applications with unrivaled efficiency, frequency, temperature, and voltage capabilities.

Request a Free Sample

View Now

Applying COTS RF/mW in Space with Assurance
Webinar Recording

In this webinar, industry experts in Hi-Rel RF electronics design, packaging, testing, and qualification of hybrid multi-chip modules (MCM), will provide the latest options and best practices in realizing the optimal RF/mW for space and high-reliability applications.

Recorded November 21, 2024

View Now

Maximizing DC-DC Power Supply for Space
Webinar Recording

In this webinar, industry experts in hi-rel power electronics design, packaging, testing, and qualification of hybrid and space-grade PCB DC-DC power supplies, will provide the latest options and the best practices in realizing the optimal power suppliers for today's high-reliability applications.

Recorded May 2nd, 2024

View Now

Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

View Now

Modernization of Near-Shored Hi-Rel Diodes Foundry and Manufacturing Operations
Press Release

Micross Hi-Rel Diodes facility in Reynosa, MX, less than 4 miles from the US border, was completely upgraded with the latest fab equipment, new infrastructure, and cleanrooms, providing expanded capabilities for custom low-rate production, as well as high volume full-rate production.

November 20, 2024

View Now

Fine & Gross Leak Test

Also referred to as Seal or Hermeticity Test, this test verifies that the hermetic seal of a component is intact and typically follows trim and form and/or RHSD of a glass seal device.

GEIA-STD-0006 Finish Replacement Qualification

The industry specification for conversion of Pb-free to tin-lead termination finishes is easily satisfied by our process. Most customers decline the test requirements based upon confidence of our robotic process, but testing is readily available at Micross.

+ Quote Cart Request Info Tech Support

The GEIA-STD-0006 Compliant Process includes:
  • Robotic-controlled six-axis dipping
  • Solder dipping under a nitrogen blanket
  • Solder-level sensing for accurate solder dipping
  • Integral component wash and dry facility
  • Preheating of components to negate thermal shock
  • Lead tinning/solder dip
  • Terminal finish conversion

IEC TS 62647-4 Qualification Ball Grid Array (BGA) Reballing

The industry specification for conversion of Pb-free BGAs to tin-lead solder balls finishes is satisfied by our process. Most customers decline the test requirements based upon confidence of our robotic process, but testing is readily available at Micross.

Ionic Contamination
Detects ionic contamination on the part that can cause current leakage between leads.

Solderability

Verifies termination finishes will readily accept solder during assembly using J-STD-002 or any military test method.

Downloads

Privacy Policy

By using this online service you accept the handling of any personal data in accordance with the Privacy Policy.

Accept