- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Micross AIT offers a high complexity package technique that allows for tighter footprint design, weight less, and have a higher power performance. This technique allows for die to be put in a single package with density array integration and gain multiple levels of munitization with the use of bare die with multiple functions. With this technique, components will reach a Moisture Sensitivity Level of 2 or higher and support operating temperatures fo more than 200°C.
System in Package is a Reliable Highly Integrated Assembly Alternative
- Facilitating large scale integration of single or multiple active & discrete components
- Utilizing commercially available active semiconductor die and discretes
- Material property selections based on operating temperature & MSL
- Traditional die attach & wire-bond, die stacking & C4 flip-chip
- Multi-layer organic, co-fired alumina, silicon & aluminum nitride based substrates for improved operating temperature range
- High density signal routing with impedance matching, single ended and differential routes.
- Screen print solder paste for discrete electrical connection with or without Epoxy Tack down
- Pocket Lid attach option for PoP visual effects and device protection
- Transfer Molded Encapsulation, Kovar seal-ring & Seam Seal LID or Solder Seal Tub lid options
Flyer - Micross Advanced Interconnect Technology
Webinar - Optimizing Hi-Rel Electronics Design for Your Applications