Plastic Packaging (BGA/CSP/QFN)

If your application or program demands a smaller, more reliable packaged component, Micross can deliver a one source solution with our chip scale packaging. Chip scale packages offer near-die size footprints and reductions to package thickness and weight.

A chip scale package combines the performance and size advantages of flip chip bare die and the reliability of an encapsulated device in one tiny package. Chip scale packaging is the ideal solution for battery-powered small form factor devices such as wearable/hand-held electronics, implantable/non-implantable medical devices, industrial sensors and a variety of defense applications.

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Key Features

  • Flexible tooling for custom packages
  • Single die design typically 20% larger than die size
  • 0.5mm pitch up to 1.27mm pitch
  • Capable of package heights <1mm
  • MSL level 3 capable

Plastic parts

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