Chip on Board (CoB)

When you need a component for benign environments, but also need to fit in small space and weight less, Micross offers a low cost, complex package technique with Chip on Board. With the Chip on Board technique, your components will still reach Moisture Sensitivity Level 4 or higher and support operating temperature of more than 105°C. Shown below is a Glob-Top component which can be avoided with our Chip on Board technique leaving no repair requirements.

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Chip on Board is a Reliable Low Cost Assembly Alternative
  • Facilitating integration of single or multiple active and discrete components
  • Epoxy die attach (conductive or non-conductive)
  • Traditional wire-bond or ribbon-bond
  • Screen print solder paste for discrete electrical connection with or without Epoxy Tack down
  • With glob-top component protection


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