In this webinar, industry experts in Hi-Rel power electronics design, packaging, testing, and qualification of Hybrid and Space-Grade PCB DC-DC power supplies, will provide the latest options and best practices in realizing the optimal power supplies for today’s high-reliability applications.
Recorded May 2, 2024
Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.
November 27, 2023
Part Number: MLN
MLN
