Packaging & Assembly

Micross has a 40+year history of being the one source provider that delivers hi-reliability packaging solutions to fit the most critical customer application. And today, we continue to offer a full range of capabilities to serve all of our customer’s complete packaging and assembly needs.  From design to test, we possess the expertise needed to support a program or application from start-to-finish.  Contact us today to see how we can assist you in selecting the best method for your application.

Complete Packaging Capabilities:

  • Hermetic Packaging: Ceramic & Metal Can’
  • Wafer-level Vacuum/Hermetic Packaging
  • Plastic Packaging: CSP/BGA/QFN
  • Custom Packaging
  • FlipChip/MCM/SiP
  • Die Stacking 2.5D/3D

Services & Support:

  • Package Design
  • Full Package Characterization
  • Turnkey Assembly & Test
  • Reliability Testing & Failure Analysis