Packaging & Assembly

Micross is the global one-source provider of IC packaging solutions to serve customer’s complete packaging, assembly and test needs.

We offer a full range of capabilities; from design to test, we possess the in-house expertise needed to support a program or application from start-to-finish. Together with our extensive offerings, we provide leading-edge packaging technologies to fit even the most complex customer requirement.

Complete Packaging Capabilities:

  • Hermetic Packaging: Ceramic & Metal Can’
  • Wafer-level Vacuum/Hermetic Packaging
  • Plastic Packaging: CSP/BGA/QFN
  • Custom Packaging
  • FlipChip/MCM/SiP
  • Die Stacking 2.5D/3D

Services & Support:

  • Package Design
  • Full Package Characterization
  • Turnkey Assembly & Test
  • Reliability Testing & Failure Analysis