Packaging & Assembly

Micross has a 35-year history of being the one source provider delivering one solution for the most critical customer application. Today, we’ve become the one source, one solution for all of our customer’s complete packaging needs, from design to test, we possess the expertise needed to support your program or application from start to finish.

Complete Packaging Capabilities:

  • Hermetic Packaging: Ceramic & Metal Can’
  • Wafer-level Vacuum/Hermetic Packaging
  • Plastic Packaging: CSP/BGA/QFN
  • Custom Packaging
  • FlipChip/MCM/SiP
  • Die Stacking 2.5D/3D

Services & Support:

  • Package Design
  • Full Package Characterization
  • Turnkey Assembly & Test
  • Reliability Testing & Failure Analysis