Micross is the global one-source provider of IC packaging solutions to serve customer’s complete packaging, assembly and test needs.
We offer a full range of capabilities; from design to test, we possess the in-house expertise needed to support a program or application from start-to-finish. Together with our extensive offerings, we provide leading-edge packaging technologies to fit even the most complex customer requirement.
Complete Packaging Capabilities:
- Hermetic Packaging: Ceramic & Metal Can’
- Wafer-level Vacuum/Hermetic Packaging
- Plastic Packaging: CSP/BGA/QFN
- Custom Packaging
- Die Stacking 2.5D/3D
Services & Support:
- Package Design
- Full Package Characterization
- Turnkey Assembly & Test
- Reliability Testing & Failure Analysis
Contact us to see how we can assist you in selecting the best method for your application.