One Source One Solution
  • Support
      • Field Support / Contacts
      • Product Catalog
      • Literature
      • Data Sheets
      • Requests
        • Request a Quote
        • Request Info
        • Tech Support
    • Close
  • About Us
      • Company Overview
      • Markets
      • Facilities & Locations
      • Operations & Quality
      • Supply Chain
      • Management Team
      • News & Info
        • Press Releases
        • Tradeshows
        • Webinars
        • Awards
        • Newsletter
    • Close
  • Careers
Micross
  • Die & Wafer Solutions
      • Die Distribution
        • Line Cards
        • Product Selector Tool
      • Die Express Quick Turn Services
      • EOL Die Sustainment Program (EDSP)
      • Wafer Processing
      • Value Added Services
        • Packaging Solutions
        • Design Support
        • Marking & Labeling / Kitting
        • 3D & Heterogeneous Integration
        • Flip Chip & MCM
        • Novel Microfabrication
        • Wafer Bumping
        • Wafer Test
        • EOL/DMS Sustainment
    • Close
  • Component Modification
      • Component Solutions
        • BGA Reballing
        • Robotic Hot Solder Dip
        • Lead Attach / Component Preparation
        • CGA Attach
        • Trim & Form and Reconditioning
      • PCB Solutions
        • Assembly
        • Rework
        • Repair
        • Component Harvesting
      • Support Solutions
        • Tape & Reel
        • 3D Scanning
        • Bake and Package
        • Marking & Labeling / Kitting
      • Value Added Services
        • Component Qualification
        • Fine & Gross Leak Test
        • Acoustic Microscopy (AM)
        • X-ray Inspection
        • X-ray Fluorescence Analysis (XRF)
        • Device Characterization
        • PEM-Quals
        • ESD Characterization
        • EOL/DMS Sustainment
        • Supplier Managed Inventory
    • Close
  • Hi-Rel Products
      • Hi-Rel Components
        • SMD/5962
        • Memory
        • Optocouplers
        • Power Devices
        • GaN Power Devices
        • Logic Functions
        • Level Translators
        • Transceivers
        • COTS/Retail+
        • Analog
        • High Temp
        • Passives
      • Hi-Rel Diodes
        • Rectifier Diodes
        • TVS Diodes
        • Zener Diodes
        • High Current Rectifier Assemblies
        • High Voltage Rectifier Assemblies
        • Single Phase Full Wave Bridge Assemblies
        • Three Phase Full Wave Bridge Assemblies
        • Center Tap and Doubler Assemblies
        • TVS Assemblies
        • Commercial Off-The-Shelf Diodes
      • Data Bus Products
      • Hi-Rel RF Solutions
      • Hi-Rel Power Solutions
        • DC-DC Converters
        • EMI Filters
      • Packaging & Assembly
        • Hermetic Packaging
        • CSP/Plastic Packaging
        • Custom Packaging
        • Multi-Chip Modules
        • Assembly Services
        • Final Test
      • Value Added Services
        • Component Modification
        • Counterfeit Mitigation
        • Environmental Testing
        • Electrical Testing
        • Wafer Bumping
        • EOL/DMS Sustainment
    • Close
  • Advanced Services
      • Advanced Interconnect
        • Wafer Bumping
        • 3D & Heterogeneous Integration
        • Flip Chip & MCM
        • Novel Microfabrication
      • Electrical Testing
        • Device Characterization
        • RF
        • High-Speed Digital
        • Wafer Test
        • PEM-Quals
        • Qualified Encapsulated Devices (QEDs)
        • Tester Rental
      • Environmental Testing
        • Component Qualification
        • Board Level Qualification
        • ESD Characterization
      • Counterfeit Mitigation
      • Component Inspection
        • Acoustic Microscopy (AM)
        • X-ray Inspection
        • X-ray Fluorescence Analysis (XRF)
        • Fine & Gross Leak Test
      • Reliability Testing
        • Burn In
        • Mechanical
    • Close
  • EOL/DMS Sustainment
      • Original Qualified Product
        • EOL Die Sustainment Program (EDSP)
        • Product Reconditioning
        • Component Harvesting
        • Counterfeit Mitigation
      • Form-Fit-Function Recreation
        • Equivalent Die Characterization & Sourcing
        • Product Recreation
        • COTS Up-screening
      • Program Sustainment Management
        • BOM Monitoring, Reporting & Management
        • Long Term Die & Wafer Storage
        • Supplier Managed Inventory
    • Close

Data Sheets

MicrossContact UsData Sheets

Standard Plastic SRAM Products

Available in Mil Temp (-55°C to +125°C), Enhanced Temp (-40°C to +105°C), and Industrial Temp (-40°C to +85°C) Ranges.

Datasheet Part Number Configuration Speed (ns) VCC (V) Package Package Designator Status
PDF AS5C1008 128K x 8 15, 20, 25 5 32PSOJ DJ Production RFQ RFI TECH
SUPPORT
PDF AS5C2568 32K x 8 12, 15, 20 5 28PSOJ DJ Production RFQ RFI TECH
SUPPORT
PDF AS5C4009 512K x 8 55, 70, 85, 100 5 32TSOP DG Production RFQ RFI TECH
SUPPORT
PDF AS5LC1008 128K x 8 10, 12, 15, 20 3.3 32PSOJ DJ Production RFQ RFI TECH
SUPPORT
PDF AS5LC512K8 512K x 8 12, 15, 20 3.3 36PSOJ DJ EOL RFQ RFI TECH
SUPPORT
PDF AS8S512K32PECB 512k x 32 12, 15, 20, 25 5 68PLCC PECA Production RFQ RFI TECH
SUPPORT
PDF AS8SLC512K32PECA 512k x 32 12, 15, 20, 25 3.3 68PLCC PECA Production RFQ RFI TECH
SUPPORT


Standard Hermetic SRAM Products

Datasheet Part Number Configuration Speed (ns) VCC (V) Package SMD 5962-
AS5C1001 1M x 1 20-70 5 32CSOJ, 32FP EOL RFQ RFI TECH
SUPPORT
AS5C1005 256K x 4 15-45 5 28CDIP EOL RFQ RFI TECH
SUPPORT
PDF AS5C2568 32K x 8 12, 15, 20, 25, 35, 45, 55, 70, 100 5 28CDIP, 28CLCC, 28CSOJ, 28FP, 32CLCC 88552 RFQ RFI TECH
SUPPORT
PDF AS5C4008 512K x 8 12, 15, 17, 20, 25, 35, 45 5 32CDIP, 32CLCC, 32CSOJ, 32FP 95600 RFQ RFI TECH
SUPPORT
PDF AS5C4009 512K x 8 55, 70, 85, 100 5 32CDIP, 32CSOJ, 32PLASTICTSOP RFQ RFI TECH
SUPPORT
PDF AS5C512K8 512K x 8 12, 15, 17, 20, 25, 35, 45 5 36CSOJ, 36CLCC, 36FP, 44TSOPII 95600 RFQ RFI TECH
SUPPORT
AS5C4009LL 512K x 8 5 EOL RFQ RFI TECH
SUPPORT
PDF AS5LC1008 128K x 8 10, 12, 15, 20 3.3 32CSOJ, 32PSOJ RFQ RFI TECH
SUPPORT
PDF AS5LC512K8 512K x 8 12, 15, 20 3.3 36CLCC, 36FP, 36PSOJ EOL RFQ RFI TECH
SUPPORT
AS8S128K32 128K x 32 15, 17, 20, 25, 35, 45 5 66PGA, 68CQFP 93187, 95595 RFQ RFI TECH
SUPPORT
PDF AS8S512K32 512K x 32 12, 15, 17, 20, 25, 35, 45, 55 5 66PGA, 68CQFP 94611, 95624 RFQ RFI TECH
SUPPORT
PDF AS8SLC128K32 128K x 32 10, 12, 15, 17, 20, 25 3.3 66PGA, 68CQFP RFQ RFI TECH
SUPPORT
PDF AS8SLC512K32 512K x 32 10, 12, 15, 17, 20 3.3 66PGA, 68CQFP RFQ RFI TECH
SUPPORT
MT5C1008 128K x 8 12, 15, 20, 25, 35, 45, 55, 70 5 32CDIP, 32CLCC, 32CSOJ, 32FP 89598 RFQ RFI TECH
SUPPORT
PDF MT5C1009 128K x 8 12, 15, 20, 25, 35, 45, 55, 70 5 32CDIP, 32CLCC, 32CSOJ, 32FP 89598 RFQ RFI TECH
SUPPORT
PDF MT5C2568 32K x 8 12, 15, 20, 25, 35, 45, 55, 70, 100 5 28CDIP, 28CLCC, 28CSOJ, 28FP, 32CLCC 88662 RFQ RFI TECH
SUPPORT


Standard Hermetic DRAM Products

Datasheet Part Number Configuration Speed (ns) VCC (V) Package SMD 5962- Status
PDF SMJ416400 4M x 4 70-100 5 24LCC, 24ZIP, 28FP, 28LCC 92312 EOL* RFQ RFI TECH
SUPPORT
PDF MT4C4001J 1M x 4 70-120 5 20CDIP, 20CLCC 90847 EOL* RFQ RFI TECH
SUPPORT
PDF MT4C1004J 4M x 1 70-120 5 20CDIP, 20CLCC 90622 EOL* RFQ RFI TECH
SUPPORT
PDF SMJ44C256 256K x 4 80-150 5 20CDIP, 20CLCC, 20CSOJ, 20FP 90617 RFQ RFI TECH
SUPPORT
PDF SMJ416160 1M x 16 70-80 5 50FP 96743 EOL* RFQ RFI TECH
SUPPORT
PDF SMJ418160 1M x 16 70-80 5 50FP 96743 EOL* RFQ RFI TECH
SUPPORT
PDF AS4C1024 1M x 1 80-120 5 18CDIP, 20CLCC RFQ RFI TECH
SUPPORT
PDF AS4C1259 256K x 1 100-150 5 18CLCC RFQ RFI TECH
SUPPORT
PDF SMJ4C1024 1M x 1 80-150 5 18CDIP, 20CLCC, 20CSOJ, 20FP RFQ RFI TECH
SUPPORT
PDF SMJ44400 1M x 4 80-120 5 20CDIP, 20FP 90847 EOL* RFQ RFI TECH
SUPPORT

*EOL - Limited Quantities Available


Standard Hermetic VRAM Products

Datasheet Part Number Configuration Speed (ns) VCC (V) Package SMD 5962- Status
PDF MT42C4256 256K x 4 100-120 5 28CDIP, 28CLCC, 28CSOJ 89497 EOL* RFQ RFI TECH
SUPPORT
PDF SMJ44C251B 256K x 4 100-120 5 28CDIP, 28CLCC, 28CSOJ 89497 EOL* RFQ RFI TECH
SUPPORT

*EOL - Limited Quantities Available


Standard Hermetic EEPROM Products

Datasheet Part Number Configuration Speed (ns) VCC (V) Package SMD 5962-
PDF AS28C010 128K x 8 120-250 5 32CDIP, 32FP Contact Us RFQ RFI TECH
SUPPORT
PDF MYXX28HC256 32Kx8 70-250 5 28CDIP, 32CLCC, 28CPGA, 28CFP, 32CSOJ RFQ RFI TECH
SUPPORT
PDF AS58C1001 128K x 8 150-300 5 32CLCC, 32CSOJ, 32FP Contact Us RFQ RFI TECH
SUPPORT
PDF AS8ER128K32 128K x 32 150-250 5 68CQFP Contact Us RFQ RFI TECH
SUPPORT
PDF AS8ERLC128K32 128K x 32 250-300 3.3 RFQ RFI TECH
SUPPORT
PDF AS58LC1001 128K x 8 250-300 3.3 32CLCC, 32CSOJ, 32FP RFQ RFI TECH
SUPPORT
PDF AS8E128K32 128K x 32 120-300 5 66PGA, 68CQFP Contact Us RFQ RFI TECH
SUPPORT


Standard Hermetic UVEPROM Products

Datasheet Part Number Configuration Speed (ns) VCC (V) Package SMD 5962-
PDF AS27C010A 128K x 8 41263 5 32LCC EOL RFQ RFI TECH
SUPPORT
PDF SMJ27C010A 128K x 8 41263 5 32CDIP EOL RFQ RFI TECH
SUPPORT
PDF SMJ27C512 64K x 8 15-25 5 28CDIP 87648 RFQ RFI TECH
SUPPORT


Standard Plastic Flash Products

Datasheet Part Number Configuration Speed (ns) VCC (V) Package Status
PDF AS28F128J3A 8Mx16 or 16Mx8 115 5 56TSOP, 64PBGA Production RFQ RFI TECH
SUPPORT
PDF AS29F040 512K x 8 55, 60, 70, 90, 120, 150 5 32CDIP, 32FP, 32GULLWING, 32LCC Production RFQ RFI TECH
SUPPORT
PDF AS29LV016D 2M x 8 70, 90, 100 3 48TSOPI EOL RFQ RFI TECH
SUPPORT
Note1 AS29LV016J 2M x 8 55, 70 3 48TSOPI Production RFQ RFI TECH
SUPPORT

1EAR (Export Administration Regulations) restricted datasheet. Please submit datasheet requests to sales@micross.com.


Hermetic Flash Products

Datasheet Part Number Configuration Speed (ns) VCC (V) Package SMD 5962-
Note1 AS8F512K32 512K x 32 70-150 5 66PGA, 68QFP 94612 RFQ RFI TECH
SUPPORT
Note1 AS8FLC1M32A 1M x 32 70-120 3.3 66HIP, 68CQFP 09205 RFQ RFI TECH
SUPPORT
PDF AS8FLC2M32 2M x 32 70-120 3.3 66HIP, 68CQFP 08245 RFQ RFI TECH
SUPPORT
PDF AS8F2M32 2M x 32 90-150 5 68CQFP EOL RFQ RFI TECH
SUPPORT
PDF SMJ28F010B 128K x 8 120-200 5 24CDIP, 32CLCC Contact Us RFQ RFI TECH
SUPPORT
PDF AS8F128K32 128K x 32 60-150 5 68CQFP EOL RFQ RFI TECH
SUPPORT
PDF AS29F040 512K x 8 55, 60, 70, 90, 120, 150 5 32CDIP, 32FP, 32GULLWING, 32LCC Contact Us RFQ RFI TECH
SUPPORT
PDF AS29F010 128K x 8 60-150 5 32CDIP, 32CLCC, 32FP, 32GULLWING EOL RFQ RFI TECH
SUPPORT

1EAR (Export Administration Regulations) restricted datasheet. Please submit datasheet requests to sales@micross.com.


Retail + (DDR3)

Sync DRAM, Double Data Rate

Datasheet Part Number Density Configuration VCC (V) Package Package Designator Status Data Rate (Mbps)
PDF MYX4DD3K256M16BG1 4Gb 32M x 16 x 8 1.35 9mm x 13mm – 96 BGA BG1 PRELIMINARY 1066, 1333, 1600, 1866 RFQ RFI TECH
SUPPORT


Plastic (IPEM DDR3)

Part # Density Description Flyer Datasheet
MYX4DD3K512M64PBG2 4Gb 512M x 64 DDR3 iPEM PDF RFQ RFI TECH
SUPPORT
MYX4DD3K512M72PBG2 4Gb 512M x 72 DDR3 iPEM PDF PDF RFQ RFI TECH
SUPPORT
MYX4DD3K128M64PBG2 1Gb 128M x 64 DDR3 iPEM PDF RFQ RFI TECH
SUPPORT
MYX4DD3K128M72PBG2 1Gb 128M x 72 DDR3 iPEM PDF PDF RFQ RFI TECH
SUPPORT


Plastic (IPEM DDR2)

Datasheet Part Number Configuration VCC (V) Package Package Designator Status Data Rate (MB/s)
PDF AS4DDR232M64 32M x 64 1.8 255PBGA PBG Contact Us 400, 533, 667* RFQ RFI TECH
SUPPORT
PDF AS4DDR232M72A 32M x 72 1.8 255PBGA PBG Contact Us 400, 533, 667* RFQ RFI TECH
SUPPORT
PDF AS4DDR264M72 64M x 72 1.8 255PBGA PBG Contact Us 400, 533, 667* RFQ RFI TECH
SUPPORT

*per I/O


DDR3

Part # Density Description Flyer Datasheet
MYX4DDR364M16JTBG 1Gb 64M x 16 DDR3 SDRAM PDF PDF RFQ RFI TECH
SUPPORT
MYX4DDR3L128M16JTBG 2Gb 128M x 16 DDR3L SDRAM PDF PDF RFQ RFI TECH
SUPPORT


SSRAM (Sync RAM)

Available in Mil Temp (-55°C to +125°C), Enhanced Temp (-40°C to +105°C), and Industrial Temp (-40°C to +85°C) Ranges

Datasheet Part Number Configuration Package Package Designator VDD (V) Status Speed (MHz)
PDF AS5SP128K32 128K x 32 Sync Pipeline 100TQFP DQ 3.31 Production 200, 166, 133 RFQ RFI TECH
SUPPORT
PDF AS5SP128K36 128K x 36 Sync Pipeline 100TQFP DQ 3.31 Production 200, 166, 133 RFQ RFI TECH
SUPPORT
PDF AS5SP256K36 256K x 36 Sync Pipeline 100TQFP DQ 3.31 Production 200, 166, 133 RFQ RFI TECH
SUPPORT
PDF AS5SP512K18 512K x 18 Sync Pipeline 100TQFP DQ 3.31 Contact Us 200, 166, 133 RFQ RFI TECH
SUPPORT
PDF AS5SP512K36 512K x 36 Sync Pipeline 100TQFP DQ 3.31 Production 200, 166, 133 RFQ RFI TECH
SUPPORT
PDF AS5SS256K18 256K x 18 Sync Burst Flow-thru 100TQFP DQ 3.3 Contact Us 113, 100, 66 RFQ RFI TECH
SUPPORT
PDF AS5SS256K36 256K x 36 Sync Burst Flow-thru 100TQFP DQ 3.3 Production 100, 66 RFQ RFI TECH
SUPPORT

1VDDQ = 3.3V or 2.5V

Standard Plastic SDRAM Products

Datasheet Part Number Configuration VCC (V) Package Package Designator Temp Range Status Speed (MHz)
PDF AS4SD16M16 16M x 16 3.3 54PINTSOPII DG -55° to +125°C Contact Us 133 RFQ RFI TECH
SUPPORT
PDF AS4SD8M16 8M x 16 3.3 54PINTSOPII DG -55° to +125°C Production 133 RFQ RFI TECH
SUPPORT
Note3 AS4SD2M32 2M x 32 3.3 86PINTSOPII DG -55° to +125°C Production 166 RFQ RFI TECH
SUPPORT
PDF AS4SD32M16 32M x 16 3.3 54PINTSOPII DG -55° to +125°C Production 133 RFQ RFI TECH
SUPPORT
Note1 AS4SD4M16 4M x 16 3.3 54PINTSOPII DG -55° to +125°C Production 125, 100 RFQ RFI TECH
SUPPORT

1Please submit datasheet requests to sales@micross.com.

2Available in /IT Temp (-40° to +85°C) & /ET Temp (-40° to +105°C) versions also.

3EAR (Export Administration Regulations) restricted datasheet. Please submit datasheet requests to sales@micross.com.

Standard Hermetic SDRAM Products

Datasheet Part Number Configuration Speed (ns) VCC (V) Package SMD 5962-
pdf SMJ626162 1M x 16 12,15,20 3.3 50FP *EOL RFQ RFI TECH
SUPPORT

*EOL - Limited Quantities Available

Special Function Products

Datasheet Part Number Description VCC (V) Package Pck. Designator Temp Range Status
pdf MYX6M4424 Dual, Low Side MOSFET Driver 4.5V-18.0V CDIP-8LD C8 -55C to +125C PROD RFQ RFI TECH
SUPPORT


MRAM

MRAM is a memory that uses the magnetism of electron spin to provide non-volatility without wear-out. MRAM stores information in magnetic material integrated with silicon circuitry to deliver the speed of SRAM with the non-volatility of Flash in a single unlimited-endurance device.

Nonvolatile Data retention - ≥20 years
Fast Symmetrical read/write - 35ns
Unlimited Endurance Unlimited endurance - No wear-out mechanism
Modular Integration Easily integrated with CMOS
Extended Temperatures -40°C < T < 150°C operation demonstrated
Highly Reliable Intrinsic reliability exceeds 20 year lifetime at 125°C

Everspin MRAM devices are designed to combine the best features of non-volatile memory and RAM to enable “instant-on” capability and power loss protection for an increasing number of electronic systems.

Everspin Product List

Part Number Configuration
MR0A08B 1Mb MRAM, x8 RFQ RFI TECH
SUPPORT
MR2A08A 4Mb MRAM, x8 RFQ RFI TECH
SUPPORT
MR2A16A 4Mb MRAM, x16 RFQ RFI TECH
SUPPORT
MR4A08B 16Mb MRAM, x8 RFQ RFI TECH
SUPPORT
MR4A16B 16Mb MRAM, x16 RFQ RFI TECH
SUPPORT
MR25H10 1Mb SPI MRAM RFQ RFI TECH
SUPPORT
MR25H40 4Mb SPI MRAM RFQ RFI TECH
SUPPORT


nvSRAM

Cypress Semiconductor is the worldwide leader in Non-volatile RAM (NVRAM) products with the broadest portfolio on the market and over 1 billion devices shipped. Cypress has two complimentary families of NVRAM products: F-RAM, the industry’s most energy-efficient serial NVRAM solution and nvSRAM, the industry’s fastest parallel NVRAM solution. Cypress was the first to produce F-RAM and nvSRAM products and has 25 years of experience in NVRAM technology.

Cypress nvSRAM Key Features:

  • 64Kb to 16Mb devices
  • Asynchronous parallel and ONFI 1.0 interface options
  • Serial interface options
  • As low as 20 ns access times
  • Infinite endurance
  • No batteries required to store data on power loss; RoHS compliant
  • Optional Real Time Clock (RTC)
REQUEST A QUOTE REQUEST INFO TECH SUPPORT


FRAM

Cypress Semiconductor is the worldwide leader in Non-volatile RAM (NVRAM) products with the broadest portfolio on the market and over 1 billion devices shipped. Cypress has two complimentary families of NVRAM products: F-RAM, the industry’s most energy-efficient serial NVRAM solution and nvSRAM, the industry’s fastest parallel NVRAM solution. Cypress was the first to produce F-RAM and nvSRAM products and has 25 years of experience in NVRAM technology.

Cypress F-RAM Key Features:

  • 4Kb to 4Mb densities
  • Serial I2C and SPI interface options
  • Parallel interface options
  • Low power, instant data capture on power loss
  • 100 trillion cycle endurance
  • No batteries required to store data on power loss; RoHS compliant
  • Radiation and magnetic field tolerant
  • Processor Companions with integrated analog and digital functions
REQUEST A QUOTE REQUEST INFO TECH SUPPORT


Component Modification

  • JEDEC MO-110
  • JEDEC MO-111
  • SUPER COMPLIANT Spider J
  • SUPER COMPLIANT Spider Gullwing
  • Thru-Hole Mountable

  • Field Support/Contacts
  • Literature
  • Data Sheets
  • Requests
    • Request a Quote
    • Request Info
    • Tech Support
Micross - One Source. One Solution.

Locations & Contact Info
Website Feedback:
webmaster@micross.com
TwitterLinkedInYouTube

  • Die & Wafer Solutions
  • Component Modification
  • Hi-Rel Products
  • Advanced Services
  • DMS/Sustainment
  • Support
  • About Us
  • Careers
  • Terms & Conditions
  • Shipping Methods
  • Privacy Statement
  • Sitemap
Our Mission:

To support customers’ system-critical requirements through delivering hi-reliability microelectronic components & services on-time and to specification.

SUBSCRIBE TO OUR NEWSLETTER
© 2023 Micross - All rights reserved worldwide. Website and services by LUXSON ltd © 2023 - all rights reserved.