- Component Modification
- +Component Solutions
- +PCB Solutions
- +Support Solutions
- +Additional Services
Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.
November 27, 2023