Trim/Form & Reconditioning

Micross  offers a range of component/lead preparation services. Micross is equipped to trim and form component packages to your exact pre-assembly specifications. We also can modify tooling to meet any custom packaging requirements. Customers can choose from various shipment options - tray, tape-and-reel or trays customized to specifications. All components are baked and dry packed for moisture protection and when requested, can be sealed in nitrogen-filled bags to extend shelf life.

+ Quote Cart Request Info Tech Support

Component Preparation Services:

Lead Trim & Form for Board Assembly: Forms and trims straight leads for surface mount or through-hole components per the customer’s drawing we can propose a drawing. An RHSD Process typically follows this process to coat leads and prevent oxidization.

Reconditioning of Bent or Damaged Leads: Robotic process realigns leads that are bent and scans to verify results. A thorough pre-process inspection is done prior to reconditioning to determine if the lead damage is repairable.

Lead Attach to Leadless Chip Carrier: Reduce solder joint stress by attaching J-shape and L-shape leads to LCCs using thermocompression bonding; Thermocompression weld for leadless chip carriers with gold plated finish.

Lead Replacement: Replace and reform gold-plated or pre-tinned leads to:

    • Change the footprint of an existing device to gain real estate or extra compliance
    • Recover a device where the leads have been trimmed too short
    • Modify leadless packages
    • Tin-Lead (5/95) solder for pre-tinned leadless chip carriers

Lead Preparation: Forms and trims straight leads for surface mount or through-hole components per the customer’s drawing or we can propose a drawing. An RHSD Process typically follows this process to coat leads and prevent oxidization.

Micross BGA Reballing Center of Excellence

 

 

Privacy Policy

By using this online service you accept the handling of any personal data in accordance with the Privacy Policy.

Accept