Wafer Test
Micross has extensive experience and in-house expertise to design test programs and perform the wafer testing and sorting using our state-of-the-art Accretech 8” and 12” wafer probers. We design vertical probe cards and develop programs for a wide range of circuits, including RF devices running as fast as 6 GHz and high-speed digital ICs with clock speeds as high as 10 GB/sec. Key features of Micross wafer test and sort services include thermal control, multi-site probing, bake retention, bumped wafer probing, in-line or off-line inking, auto alignment and probe mark and wafer ID inspection.
Micross Advantages
- More than four decades of experience serving Aerospace, Defense, Space and Industrial markets
- 300 mm (12 inch) and 200 mm (8 inch) capabilities
- RF speeds up to 6 GHz
- High-speed digital ICs up to 10 GB/sec
- Direct dock 12"/300mm wafer probers
- 6", 8" or 12" wafer capacity, final test at wafer level
- Hot-probe facility (25C to130C) up to 200C for limited tests
- Full parametric testing functional test
- Speed or Trim binning
- Multi-map wafer mapping probing and traying system
- Wafer-Level Programming
Equipment
Testers
- Verigy/Advantest 93K SOC
- Verigy/Advantest 93K PinScale
- Verigy/Advantest 93K PortScale
- Verigy/Advantest 93K SmartScale SL
- LTX-Credence D10
- LTX Credence Quarter
- LTX Credence SC312/SC212
- LTX Credence ASLX
- LTX Fusion CX