Device Characterization

Micross provides a comprehensive array of complete Turnkey Test & Device Characterization solutions inclusive of the following capabilities:

Test Program Development

• Multiple platform expertise

Characterization

• High-speed yield optimization

Wafer Sort/Wafer Probe

• Up to 300mm wafer probe

Production Test

• Full IC package testing and hybrid testing. Wafer-level testing. High-speed, multi-site delivery

Program Conversion

• Technology migration to improve cost effectiveness

Micross’ in-house technically-advanced engineering team can support all technologies, including RF, digital, linear, analog mixed signal and memory.