Turnkey Device Characterization
Micross provides a comprehensive array of complete Turnkey Test & Device Characterization solutions inclusive of the following capabilities:
Test Program Development
- Multiple platform expertise
Characterization
- High-speed yield optimization
Wafer Sort/Wafer Probe
- Up to 300mm wafer probe
Production Test
- Full IC package testing and hybrid testing. Wafer-level testing. High-speed, multi-site delivery
Program Conversion
- Technology migration to improve cost effectiveness
Micross’ in-house technically-advanced engineering team can support all technologies, including RF, digital, linear, analog mixed signal and memory.