3D InCites Device Manufacturer of the Year: Micross AIT
In a final vote of 3-2, Micross AIT pulled into the lead because of its broad range of 3D process capabilities and successful demonstrations of 3D-integrated IC stacks for IR focal plane arrays and silicon interposer for embedded computing modules. Micross AIT has been conducting research and development in 3D integration since 1999, building on decades of experience in the development of advanced microfabrication and packaging technologies.
Outstanding Supplier 2014, BAE Systems
For consistently demonstrating outstanding achievements in support of the space-qualified rad-hard SRAM memory module and advanced ASIC products.
“STS has proven itself as a superior services provider by their timely deliveries and consistently high quality, which supported BAE Systems in achieving mission critical objectives.”
World-class Team Award 2011, Northrop Grumman
For consistently demonstrating outstanding achievements and support of NGCAS programs.
“No matter the program or technology, STS delivers consistently with high product quality, and cost competitive performance. STS operates as a capable team member sharing our goal for success and engaging NGCAS when challenges arise.”
Chairman’s Award 2011, BAE Systems
Outstanding contribution for the development, evaluation and space flight readiness of a multichip module. This was a technical collaboration for BAE’s next generation and innovative multi die solution. STS was recognized for its core competency and technical contribution in designing and manufacturing a space-grade solution.