Title: Developing Advanced Packaging Supply Chains for Onshore Microelectronics Production
Recorded: October 2nd, 2025 at 11am ET
With 98% of OSAT (Outsourced Semiconductor Assembly & Test) manufacturing performed in Asia, rising geopolitical tensions and trade levies are driving US based OEMs and CMs (Contract Manufacturers) to reevaluate the supply chain risks and increased costs of their overseas OSAT microelectronics production services. Considering US onshoring of the OSAT services you require? This can be a daunting challenge as there are a limited number of providers and most will not respond to smaller quantity needs. Of the remaining, almost none have the necessary equipment and labor expertise to match the capabilities of overseas OSAT providers, and instead rely on multiple resources for assembly, packaging and testing. Dependency on multiple OSAT resources increases development and production risks; minimizes individual provider accountability of the device solution if issues arise; and injects the likelihood of processing and logistical delays, along with cost overruns.
Ensuring a successful OSAT supply chain implementation provides market leading advantages for new product introductions, enabling commercial parts to go to market faster, while realizing significant cost savings. Successful OSAT providers will optimize yield through product characterization, serve as an extension of your R&D and production operations, and offer the engineering capabilities and know-how needed to bring multiple technology nodes into the package, integrating various semiconductor materials from multiple wafer types and diameters to create a heterogenous solution at the scale required to fulfill your needs.
In this webinar, we will cover the resources and requirements to develop an efficient and reliable advanced packaging supply chain for US based microelectronics production. Experts in BEOL processing, advanced 2.5/3D heterogenous integration, testing, and component packaging will provide deep insights into the requirements and best practices in establishing a US based advanced packaging supply chain. Attendees will gain a comprehensive understanding of the required onshore resources currently available, and the guidelines needed to navigate the risks in developing a US-based advanced packaging supply chain for high-reliability microelectronics.
Featured Speakers:
Craig Hardin
Director of Product Line Management at Micross Advanced Interconnect Technology
Craig Hardin is the Director of Product Line Management for our Advanced Interconnect Technology group within the Products & Services division of Micross Components. He holds a Masters (MS) degree in Mechanical Engineering from North Carolina State University with a focus on compound semiconductor research. Craig has over 20 years of semiconductor experience at Wolfspeed and Cree LED from front-end fabrication through back-end component assembly and has held various engineering, marketing and product line management roles throughout his career.
John Bowling
Director of Engineering at Micross Silicon Turnkey Solutions
John Bowling is the Director of Engineering for Micross’s Silicon Turnkey Solutions Division in Milpitias, California. Prior to joining Micross in December of 2024, John spent over 25 years at Intel Corporation, working on Itanium and XEON Server Chip Design, Design for Test, and Post Silicon Test. John gained expensive experience with chiplets as the manufacturing Chief Engineer of a disaggregated XEON Server product.
Adam Johnson
Senior Account Manager at Integra Technologies
Adam has been with Integra for nearly 20 years. He holds bachelor’s degrees in both electrical and computer engineering. His experience as a reliability and test engineer affords him a breadth of knowledge in the semiconductor reliability testing field. Adam has been involved in industry committees CE-12 and JC-13, and most recently was a technical advisor for the JC-13 Committee burn-in/life task group. He currently serves as a technical account manager at Integra where he advises both internally and externally on proper application of specifications for aerospace, defense and space applications.
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