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The Most Complete Provider of Advanced Microelectronic Services
and Component, Die & Wafer Solutions
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August 2025 | Expanded NED Product Line & Onshoring US Supply Chains Micross is dedicated to serving the high-reliability microelectronics needs of the aerospace, defense and space markets, from sustaining programs initially deployed decades ago, to delivering cutting-edge solutions that position the U.S. and its allies with advantages over threats both at home and abroad. In this edition, discover our expanded offering of Nuclear Event Detectors (NEDs), designed to protect critical systems on Earth and in space, allowing these systems to operate through the electromagnetic pulse (EMP) resulting from a nuclear event. We also invite you to attend our upcoming webinar focused on developing a US-based microelectronics advanced packaging supply chain for onshore production. Join us for an opportunity to engage with our product experts and executives in person to discuss your high-reliability requirements at one of the upcoming conferences where we'll be exhibiting, be sure to check out the list for September!
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Expanded NED Product Offering
Micross expands its industry leading line of NEDs, offering 3 performance variants to optimally serve your requirements for the application and environment. Micross offers High-Performance and Standard-Performance Nuclear Event Detectors (NEDs) in addition to our First-Generation NED. The High-Performance and Standard-Performance NEDs feature integrated differential drivers and receivers, providing improved overall noise immunity; size, weight and power (SWaP) optimization, and additional response time improvements. The High-Performance NED offers 300% greater radiation dose sensitivity, and 25% faster response times at 5x lower overdrive ratios relative to legacy NEDs. The Standard-Performance NED offers 100% greater radiation dose sensitivity, and faster response times at 5x lower overdrive ratios relative to legacy NEDs.
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Developing Advanced Packaging Supply Chains for Onshore Microelectronics Production
In this webinar, we will cover the resources and requirements to develop an efficient and reliable advanced packaging supply chain for US based microelectronics production. Experts in BEOL processing, advanced 2.5/3D heterogenous integration, testing, and component packaging will provide deep insights into the requirements and best practices in establishing a US based advanced packaging supply chain. Attendees will gain a comprehensive understanding of the required onshore resources currently available, and the guidelines needed to navigate the risks in developing a US-based advanced packaging supply chain for high-reliability microelectronics.
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Ensure Performance, Reliability, and Safety for High-Stakes Applications with Advanced Die Attach Solutions Die attach is a critical step in semiconductor packaging where the silicon die (or chip) is securely mounted onto a substrate, lead frame, or package base. This process forms the physical and thermal bridge between the die and the rest of the device, directly impacting performance, reliability, and lifespan. Whether using epoxy, solder, or sintering techniques, the die attach process must be carefully controlled for alignment, voids, and bond quality—making it one of the foundational steps in high-quality semiconductor packaging. For more information, read Integra's August FAQ Newsletter! Integra is a Micross Company.
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Micross will be showcasing our latest solutions for space, aerospace, defense, RF, and other hi-rel markets. Our product experts and executives will be on site to discuss your technical and program needs.
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DSEI September 9-12 Excel, London Booth S1-225
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EuMW - European Microwave Week September 21-26 Jaarbeurs Utrecht, Netherlands RFMW Booth C046
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iMAPS Symposium 2025 September 29 - October 2 San Diego, CA Booth #709
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SMD - Space & Missile Defense Symposium August 5-7, 2025 – We had a very successful week at the Space and Missile Defense Symposium! We were excited to meet with LTG Sean Gainey, LTG (retired) Stephen M. Twitty, and other notable leaders, to discuss the Golden Dome and strategic missile defense initiatives, sharing our U.S based end-to-end hi-rel microelectronics offering and supply-chain sustainment solutions for aerospace, defense, and space. We thank everyone who stopped by our booth and look forward to continuing these discussions!
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Small Satellite Conference August 10-13, 2025 – A wonderful time was had exhibiting at Small Satellite Conference 2025. It was clearly evident that the expansion of the New Space satellite market is accelerating and we were very happy to support our current and new customers and partners in attendance, sharing our new offering of cost-efficient space-grade microelectronic solutions. Thank you to all who stopped by our booth, we look forward to continuing to aid in the New Space market.
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DPMC - DMSMS & Parts Management Consortium August 11-14, 2025 – Thank you to all who visited our booth at DPMC 2025, where we showcased our comprehensive portfolio of DMSMS sustainment and life-cycle management services. Our commitment to supporting mission-critical systems is unwavering, and we are proud to contribute our expertise to this vital initiative.
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