- Over 1200 sq. ft. of Class 100 controlled environment
Broad range of precision automated equipment:
- Wafer probers & saws
- Wafer-level packaging
- Die assembly
- Robotic solder machines & coating processes
- Advanced electrical test equipment and a comprehensive mix of sophisticated environmental chambers.
- Highly skilled Engineering Team has developed proprietary competence across a range of capabilities from ceramic package design, to test load-boards, chamber-less burn-in and differentiated component modification solutions.