World-Class Engineering & Advanced Equipment

Capabilities:

  • Over 1200 sq. ft. of Class 100 controlled environment

Broad range of precision automated equipment:

  • Wafer probers & saws
  • Wafer-level packaging
  • Die assembly
  • Robotic solder machines & coating processes
  • Advanced electrical test equipment and a comprehensive mix of sophisticated environmental chambers.
  • Highly skilled Engineering Team has developed proprietary competence across a range of capabilities from ceramic package design, to test load-boards, chamber-less burn-in and differentiated component modification solutions.