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Ruggedizing COTS Components for Hi-Rel

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Prior to the 21st century, only hermetically packaged ceramic components were considered for high-reliability safety-critical Space, Aerospace, and Defense applications; the axiom or accepted truth for electronics specified for extreme performance and environmental requirements. This design rule ensured component reliability, albeit at a dramatic cost premium to commercial grade electronics.

Primes and OEMs now design standard COTS components into these safety-critical high-reliability applications, and have been deploying them with success. However, the development cost savings realized with using standard COTS in these hi-rel applications instead of Hermetics/Ceramics, is quickly superseded by the high replacement costs (re-launch and system replacement) resulting from shorter program longevity. With the extreme solar thermal cycling imposed on satellites during their 15 orbits per day (5,500/year), non-ruggedized electronics degrade quickly, in many cases only surviving a mission life of 2-3 years or less.

In this webinar, experts in component high-reliability modification from the US and UK will present all of the techniques designers have been widely adopting to extend their mission’s life by 3X and more, through the use of component modification ruggedization processing applied to standard nominally-priced COTS components.

Recorded: September 28th, 2023

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