Micross Hi-Rel Microelectronic Products & Services at Electronica 2018


ORLANDO, Florida, November 7, 2018 — Micross is excited to once again participate at electronica 2018, November 13-16, in Munich, Germany. Micross will showcase all of its hi-reliability capabilities inclusive of:

  • Bare Die & Wafer Processing
  • Broadest Access to Bare Die 30+ Manufacturers
  • Advanced Interconnect Technology
  • Wafer Bumping / Wafer-Level Packaging
  • Packaging & Assembly
  • Optoelectronic & Silicon Photonics Assembly
  • Component Modification
  • BGA Reballing / Column Grid Array (CGA)
  • Advanced Testing Services: Electrical & Environmental Test
  • FPGA, ASIC, RF Test / Life Test & Burn-in
  • Hi-Rel Products
  • SMD/5962 & Extended Temp. Plastic

electronica 2018
Visit Micross in Hall C5, Stand 436 to enter our daily stand raffle.  For more information about Micross’ presence at electronica, visit https://www.micross.com/electronica-2018/

About Micross

Micross is the one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for more than 40 years, our comprehensive array of hi-reliability capabilities serve the global Defense, Space, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.  For additional information, visit www.micross.com

Micross Corporate Contact:
Valerie Thomas, Director of Marketing Communications