September 2023: Ruggedizing COTS for Hi-Rel Applications
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The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions
September 2023 | Ruggedizing COTS for Hi-Rel Applications
Unable to source the hi-rel components needed for your application, or seeking a less costly alternative to conventional ceramic packaged ICs? You’re not alone! Our September issue includes the Component Modification Services available to ruggedize COTS for use in high-reliability aerospace, defense, and space applications! If this topic is of interest or you are currently facing supply chain challenges sourcing the hi-rel components needed for your application, please use the registration link below to join us for the webinar we will be hosting next Thursday, September 28th, "Ruggedizing COTS Components for Hi-Rel Applications.” Experts in component modification and solder-exchange for hi-rel applications will share insights on how to minimize cost and extend mission life by 3x and more, through ruggedization of the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available!
Ruggedizing COTS Components for Hi-Rel Applications
Date/Time: September 28th, at 11am ET Duration: 1 Hour
Minimize cost and extend mission life by 3x or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.
In this webinar, experts in component high-reliability modification from the US and UK will present all of the techniques designers have been widely adopting to ruggedize standard nominally-priced COTS components for hi-rel applications.
Micross' BGA Reballing Process flushes all lead-free balls and alloy residue from the pads and replaces them with tin-lead balls, eliminating the risk of tin whiskers, and ensuring the strongest solder joint.
From dip depth, dwell times, temperatures, continuous chemical monitoring and proprietary processes, no one in the industry comes close to the precise controls of Micross' RHSD equipment. Micross pioneered RHSD in 1984.
Micross proprietary process maintains solder joints integrity under extreme conditions, By using high-compliance leads that allow the component to flex, solder joints are protected from mechanical and thermal stresses.
Micross is able to process ceramic & plastic LGAs and BGAs with a 1.00mm or 1.27mm pitch, with up to 2500 interconnects. CGA columns provide superior performance over BGA in thermal cycling and mechanical stress.
Micross Component Modification Services facilities in the US and Europe are Nadcap certified. Nadcap accreditation requires a contractor to be AS9100 certified with QMS requirements in place, and demonstrates that the supplier meets all the requirements for specific aerospace industry special processes.
Micross will be showcasing our latest solutions for space, aerospace, defense, RF, and other hi-rel markets. Our product experts and executives will be on site to discuss your technical and program needs.
We had an exciting week at DSEI, and look forward to connecting with you at our next show.
Micross is the most complete provider of advanced microelectronic services and component, die and wafer solutions. With the broadest authorized access to die & wafer suppliers, an extensive portfolio of hi-rel power, RF, optoelectronics, memory, data bus, logic, and SMD/5962 qualified products, and the most comprehensive advanced packaging, assembly, modification, upscreening, and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions, from bare die, to fully packaged devices including hermetic ICs/MCMs, PEMs, ASICs, FPGAs, and PCBs, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical, energy, communications, and industrial markets.