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The Most Complete Provider of Advanced Microelectronic Services
and Component, Die & Wafer Solutions
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October 2023 | Die & Wafer Solutions With 45+ years of experience, the largest authorized offering of bare die, and the most comprehensive portfolio of wafer processing capabilities, Micross is the one source solution for all your die and wafer needs! In this issue, we highlight the extensive access to die, wafer, and the comprehensive end-to-end wafer capabilities available through Micross. Additionally, we welcome you to join our upcoming webinar on processing microelectronics for hi-rel environments through best practices in up-screening, ASIC design, and hermetic packaging. Also, we hope to see you at Space Tech Expo Europe, November 14-16, in Bremen, Germany, our product experts and executives will be on-site discuss your program and technical needs.
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Die Distribution - Over 50 million parts in stock, for more than 5,000 device types.
- Largest franchised offering of bare die and wafer.
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Die Express - Quick-Turn quote processing in 24-48 hrs
- In-stock parts ship within 4 days after purchase order
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Long Term Die & Wafer Storage - Access to a product years after the LTB
- Cost-effective extension of project life
- Products are stored in a dedicated ESD-controlled environment, in special smoke and water-resistant containers within a dry nitrogen environment that prevents contamination
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Wafer Probe - Solder & Gold Bump Available
- In-House Design Services and Technical Support
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Wafer Bumping & RDL - Hot & Cold Chuck Temperature Probing
- Up to 12” Wafer Capacity, Final Test at Wafer Level
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Wafer Sawing - Wafer thinning down to 100µm
- ±1µm dicing tolerance
- Custom Dicing Plans, multi-project wafers
- Processing capability up to 12" (300mm)
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Die Platting / Pick & Place - Automated contactless handling
- Multiple bins / grade die picking
- Safe Handling of sensitive topside & 3D features
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Visual Inspection - AQL
- MIL-STD (commercial, military, and aerospace grades).
- Inspection via AOI equipment
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Customized Output - Sawn wafer on film-frame and ring-frame
- Waffle Pack or Gel Pack®
- Tape-N-Reel
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Supplier Product Selector Guide
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Quickly Find the Devices You Need, from the Suppliers You Trust! This flyer provides a complete overview of our die & wafer product and service offerings, including our most popular suppliers and the device types they offer.
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Realize the Leading Advantages & Best Practices in Preparing Microelectronics for High-Reliability Applications Date/Time: November 30th, at 11am ET
Duration: 1 Hour
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Demystifying Semiconductor Die Procurement… Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need Recorded: June 20th, 2023
Duration: 1 Hour
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Anyone who designs high-reliability electronics for aerospace, military, and space applications has an initial decision of whether their desired design can be achieved with standard COTS (commercial-off-the-shelf) microelectronics, or if a more SWaP optimized solution is needed, designing from the semiconductor bare die level would be required. In this webinar, Semiconductor Die & Wafer manufacturing experts, from leading OEMs, Distribution, and Back-End Semiconductor Value-Added Service providers, demystify the required processing and procurement of semiconductor die, and provide clear actionable guidance to navigate and mitigate potential risks in procuring bare die processed to your required specifications for high-rel aerospace, military, and space applications.
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Micross will be showcasing our latest solutions for space, aerospace, defense, RF, and other hi-rel markets. Our product experts and executives will be on site to discuss your technical and program needs.
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Space Tech Expo Europe Booth #C40 November 14-16 Bremen, Germany
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