March 2022: New Die/Wafer Suppliers & APAC Sales Director
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The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions
March 2022 | New Die/Wafer Suppliers & APAC Sales Director
We're excited to share 2 new suppliers that were recently added to our line card, our new Sales Director and sales office for the Asia-Pacific region, and that we were awarded "Device Manufacturer of the Year" by 3D InCites. In addition, we look forward to meeting with you at our upcoming trade shows where you can discuss your program needs with our Executives and Product Line Experts.
Micross is proud to announce our new distribution partnership agreement to be the provider of ISOCOM Limited's expanding portfolio of radiation tolerant Optoelectronic and Power components for the United States and India.
Micross & Apogee Semiconductor rad-hardened solutions offer a more cost-effective approach to achieving radiation and temperature requirements for extreme environments, from LEO to deep space, while also enabling SWaP optimization.
The EPC7019, a 40 V, 1.5 m?, 530 APulsed, rad-hard eGaN FET in a small 13.9 mm2 footprint. The EPC7019 has a total dose rating greater than 1 Mrad and SEE immunity for LET of 85 MeV/(mg/cm2). These devices are offered in a chip-scale package, the same as the commercial eGaN FET and IC family. Packaged versions will be available fromEPC Space.
Micross is pleased to announce the appointment of Valli Murugappan to the position of Sales Director for the Asia Pacific (APAC) region, operating from Singapore. In addition, we are also pleased to announce the opening of a new Micross Sales Office in Bangalore, India, led by Anand Panneer, that will provide customer success services, including Customer Service and Applications Engineering support.
In a final vote of 3-2, Micross AIT pulled into the lead because of its broad range of 3D process capabilities and successful demonstrations of 3D-integrated IC stacks for IR focal plane arrays and silicon interposer for embedded computing modules. Micross AIT has been conducting research and development in 3D integration since 1999, building on decades of experience in the development of advanced microfabrication and packaging technologies.
Micross... The Most Complete Provider of Advanced Microelectronic Services, and Component, Die & Wafer Solutions. With the broadest authorized access to die & wafer suppliers, and the most comprehensive advanced packaging, assembly, modification and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical and industrial markets.