The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions
June 2022 | Hi-Rel Products
In this issue we're very pleased to announce the further expansion of our Hi-Rel Products group with the acquisition of PAAL Technologies, a leader in high reliability data bus couplers and harness assemblies. We will be hosting a webinar, "Optimizing Hi-Rel Electronics Design for your Application" on July 7th, where industry experts will share their insights on all available microelectronic options and the rationale for selection when viable commercial options are not available. Also highlighted in this issue are the upcoming tradeshows and conferences where you can meet with our experts in person.
New Hi-Rel Data Bus Couplers & Harness Assemblies
Micross Acquires PAAL Technologies and Expands its Hi-Rel Products Offering with MIL-STD-1553 Data Bus Couplers & Harness Assemblies
Melville, NY (May 17, 2022) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical, energy, industrial and other applications, today announced the acquisition of PAAL Technologies (“PAAL”), a leading provider of MIL-STD-1553 Data Bus Couplers, Harnesses and RF/Wideband Transformers. The acquisition further expands the Hi-Rel Components portfolio of Micross, while providing customers of PAAL with single-source access to the most complete offering of end-to-end advanced microelectronic services and component, die and wafer solutions.
Optimizing Hi-Rel Electronics Design for your Application
Expert insights on all microelectronic options & the rationale for selection.
July 7th, 2022
In this webinar, we have gathered a group of veteran industry experts in the field of semiconductors and advanced microelectronics packaging and assembly, to share their insights on the logic and rationale designers should consider to meet their qualification and environmental/use requirements, as well as optimize their cost, power, performance, size, and time-to-market, when selecting one or more of the many hi-rel electronic component solution paths that are now available.
Micross... The Most Complete Provider of Advanced Microelectronic Services, and Component, Die & Wafer Solutions. With the broadest authorized access to die & wafer suppliers, and the most comprehensive advanced packaging, assembly, modification and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical and industrial markets.