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The Most Complete Provider of Advanced Microelectronic Services
and Component, Die & Wafer Solutions
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July 2023 | Space-Grade Microelectronic Products & Services Micross is the one source solution for all your space-grade microelectronic needs! In this issue, we are pleased to share our comprehensive portfolio of hi-rel products and services for space. Also highlighted in this issue are the upcoming tradeshows and conferences where you can meet with our executives & technical experts in person.
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Space Grade MRAM
Offering the most compact & lowest power package, Micross' hermetic and QED STT-MRAM provide near infinite endurance and best-in-class non-volatile memory data retention. > QED Overview Flyer
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Hi-Rel Power Solutions
The broadest and highest performance DC-DC converters for space and hi-rel applications, including custom boards and hermetic hybrids. > Overview Flyer
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Hi-Rel RF Solutions
Bringing technology together to solve the most demanding requirements for space. GaN/GaAs switches, attenuators, aplifiers, multi-chip modules and more. > Overview Flyer
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Hi-Rel Diodes
Space-grade JANS diodes available in axial and surface mount packages, as well as modules, ISOPACs, and custom assemblies & configurations. > Overview Flyer
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1553 Data Bus Couplers & Harnesses
A full range of standard and custom, MIL-STD-1553 data bus components and RF transformers for signal processing applications in the Aerospace, Defense, and Space industries. > Overview Flyer
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Component Modification Services When the space-grade components you need are not available, Micross' Component Modification Services can keep your program on schedule by transforming COTS to hi-rel for space.
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CGA Column Attach
Micross' is able to process both ceramic & plastic LGAs and BGAs with a 1.00mm or 1.27mm pitch, and devices with up to 2500 interconnects. > More Info
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Robotic Hot Solder Dip (RHSD)
From dip depth, dwell times, temperatures, continuous chemical monitoring and proprietary processes, no one in the industry comes close to the precise controls of Micross' RHSD equipment.
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BGA Reballing
Micross' BGA Reballing Process flushes all lead-free balls and alloy residue from the pads and replaces them with Tin-Lead balls.
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Complete PEMS/COTS Upscreening & Qualification.
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When a military or space grade device is made obsolete, designers must scramble to find a replacement to avoid the unwelcome prospect of redesigning the product for a different device. Working to customer's specifications, we design a custom workflow using well-maintained, calibrated equipment in our laboratory. The upscreening process identifies COTS that meets customer-specific requirements to serve as replacements for the obsolete or unavailable devices.
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With the world's largest franchised offering of bare die & wafer, and the most extensive portfolio of end-to-end microelectronic services, Micross is uniquely able to support the most stringent requirements for space, from die selection and processing, through component design and production. With access to next-gen materials including GaN and SiC, Micross is unmatched in providing microelectronic solutions for the most advanced space systems.
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Click logos below for more info
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Making COTS Hi-Rel for Space with Component Modification Date: September 28th, 2023
Duration: 1 Hour
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When the space-grade components you need are not available, Micross' Component Modification Services can keep your program on schedule by transforming COTS to hi-rel for space! Utilizing Micross' industry leading processes for Robotic Hot Solder Dip (RHSD) and BGA reballing, tin solder can be exchanged with tin-lead solder, eliminating the risk of tin whiskers. Micross' Component Modification Services also offers solder deguilding providing mitigation of gold embrittlement to J-STD-001, and Column Grid Array (CGA) column attach providing superior performance over BGA in thermal cycling. Click "Save the Date" below to provide us with your email. We'll notify you when registration is available.
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Demystifying Semiconductor Die Procurement... Bridging the Divide Between Semicondutor Die Manufacturers and the Processed Bare Die You Need Recorded: June 20th, 2023
Duration: 1 Hour
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There are many advantages with utilizing semiconductor bare die in the design of high reliability electronic components, including the ability to maximize SWaP (size, weight, & power) optimization. However, procurement of the semiconductor die needed is not as straightforward as the procurement of of-the-shelf packaged components. For those that have a need to procure semiconductor die, while the benefits to your product design will be great, the steps and processing required can be daunting. In this webinar, Semiconductor Die & Wafer manufacturing experts, from leading Original Device Manufacturers, OEMs, Distribution, and Back-End Semiconductor Value-Added Service providers, demystify semiconductor die procurement, and provide clear actionable guidance to navigate and mitigate potential risks in procuring bare die processed to your required specifications.
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Micross will be showcasing our latest solutions for space, aerospace, defense, RF, and other hi-rel markets. Our product experts and executives will be on site to discuss your technical and program needs.
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Small Sat Conference Micross Booth #136
August 5-10
Logan, UT
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SMD - Space & Missile Defense Symposium Micross Booth #E107
August 8-10
Huntsville, AL
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DSEI 2023 Micross Booth #H7-317
September 12-18
Excel, London
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