In this issue, we're proud to announce our new global distribution partnership with EPC Space, and the further expansion of our Hi-Rel Products group with the appointments of general managers Michael Agic and Estro Vitantonio. If you missed our webinar "Optimizing Hi-Rel Electronics Design for you Application", the recording is now available! In this webinar industry experts in the field of semiconductors and advanced microelectronics packaging and assembly share their insights on the logic and rationale designers should consider. Also highlighted in this issue are the upcoming tradeshows and conferences where you can meet with our experts in person.
Micross Announces Global Distribution Partnership with EPC Space... Expands Rad-Hard Gallium Nitride (GaN) Power Device Offering
EPC Space produces revolutionary GaN devices that are smaller, lighter and better performing... meaning the devices have many times superior switching performance compared to silicon solutions. To complement the EPC Space discrete products, Micross will also distribute EPC Space’s family of rad hard enhancement mode GaN drivers and power stages.
Only Micross offers… franchised access to the largest selection, from the world’s leading semiconductor ODMs… along with the most comprehensive array of advanced processing & packaging services, including 3DHI, ASICs, FPGA’s, and MCMs, for hi-rel industrial and RF to aerospace/defense and space applications… with local support globally, from operations, engineering, and field support in North America, Europe, and Asia.
Micross Components' Hi-Rel Products Division Expands Leadership with the Appointments of General Managers Michael Agic and Estro Viantonio
We're pleased to announce the expansion of our Hi-Rel Products Division with the appointments of Michael Agic to the position of General Manager of Micross Hi-Rel Components, and Estro Vitantonio to the position of General Manager of Micross Hi-Rel Diodes and Data Bus Couplers & Harness Assemblies.
Optimizing Hi-Rel Electronics Design for your Application
Expert insights on all microelectronic options & the rationale for selection.
Recorded July 7th, 2022
In this webinar, we have gathered a group of veteran industry experts in the field of semiconductors and advanced microelectronics packaging and assembly, to share their insights on the logic and rationale designers should consider to meet their qualification and environmental/use requirements, as well as optimize their cost, power, performance, size, and time-to-market, when selecting one or more of the many hi-rel electronic component solution paths that are now available.
Eliminate the Risk of Potentially Using Counterfeit Parts.
Recorded February 24th, 2022
If you design, specify, or purchase hi-rel electronics, and find yourself with non-franchised components due to supply chain disruptions and material shortages, don’t miss out on this insightful webinar!
With the new normal constrained state of the electronics supply chain, there is an increased potential risk that counterfeit parts may be included in your shipment. Gain perspectives on the new era of supply chain challenges, including the expanded use of counterfeit components, and the solutions that will enable you to prevent the costly potential use of counterfeits, in a thought leadership discussion with veteran executives from L3Harris Technologies, ERAI (Electronic Resellers Association International), IDEA (Independent Distributors of Electronics Association), and Micross.
Micross... the most complete provider of advanced microelectronic services and component, die and wafer solutions. With the broadest authorized access to die & wafer suppliers, and the most comprehensive advanced packaging, assembly, modification and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical, energy, communications, and industrial markets.